edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 60 ABOUT THE AUTHOR MarkTehranipoor is currently the Intel Charles E. Young Preeminence Endowed Chair Professor in Cybersecurity and the chair of the department of electrical and computer engineering (ECE) at the University of Florida. He served as the founding director for Florida Institute for Cybersecurity (FICS) Research from 2015-2022, and currently serves as director for Edaptive Computing Inc. TransitionCenter (ECI-TC), co-director for the AFOSR/AFRL Center of Excellence on Enabling Cyber Defense in Analog andMixed Signal Domain, and co-director for theNational Microelectronic Security Training Center. Accelerated Analysis. ............................................ 60 Allied High Tech. .......................................30-31 / 46 ASM International. ................................................ 45 Bruker Corp........................................................... 46 Checkpoint Technologies................................18-19 Quantum Focus..................................................... 41 Quartz Imaging Corp.. .......... 46 / Inside back cover SEMICAPS.........................................................42-43 Ted Pella........................................................... 3 / 47 TESCAN USA Inc....................47 / Inside front cover Thermo Fisher....................................................... 47 ULTRA TEC........................................47 / Back cover Zeiss....................................................................... 47 For advertising information and rates, contact: Kelly Johanns, Business Development Manager 440.671.3851, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL CONTINUED FROM PAGE 2 abstraction layers, which is paramount for system-level security verification; (2) Implementing generic and particularly sustainable securitymodules with upgradability against zero day is of high importance; (3) The utilization of provenance technologies such as blockchain provides great capability in creating an ecosystem of trusted microelectronics to thwart recycled, cloned, remarked, and overproduced ICs; (4) Expanding security-oriented solutions for chiplets andheterogenous integration, as the next generation of microelectronic devices, fromphysical protection to physical verification is needed as an increasingnumber of companies are turning to chiplets toachieve economic advantage.
RkJQdWJsaXNoZXIy MTMyMzg5NA==