edfas.org 59 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 Councils, staffed with a committee of motivated subject matter experts and directed by two chairs, have invested significant time and energy into accurately detailing the relevant technical challenges their respective teams are facing. In parallel with these efforts, the FAFRC has been looking ahead to determine what may be coming next by surveying reputable industry roadmaps and reporting on related near-term developments/challenges that have a tangible five year or more horizon. Figure 1 highlights the FA Roadmap structure and recognizes the Council Chairs and Technical Committee members who have been leading these efforts across their respective spheres of interest. This year, the fruits of their labor are upon us. At ISTFA 2022 in Pasadena, Calif., wewill host the first ever plenary FA Roadmap session (Wednesday, November 2, from 8:00 to 9:30 a.m.) in which our Council Chairs will share summary presentations of their respective gap analyses and seek feedback fromthe audience. We encourage your strong participation for this special event. In addition to summary sharing at ISTFA, our Councils are preparing detailed technical reports whichwill offer a deep dive into the full program of their respective efforts. These reports will be prepared in time for ISTFA and shared with the wider FAcommunity as uneditedcopies viaASMCONNECT, our online community portal. Final publication-ready articles will be worked on throughout 2023 and made available for consumption and referencing using ASM’s Digital Library. Advertising this material will take place in cadence with the quarterly publication cycle of EDFA magazine. As such, dedicated FA Roadmap updates will be provided in every 2023 magazine edition in which we will sequentially focus on the gap analysis produced per Council. A link to the final articles in the ASMDigital Library will of course be provided. Communication is vital to the success of our program and so, in addition to the above, an international outreach effort is also planned in which our gap analyses will be shared at the CAM Workshop in Halle, Germany, and the International Symposium on the Physical Failure Analysis of Integrated Circuits (IPFA) Conference in Singapore in 2023. The gap analyses shared at ISTFA 2022 and revisited throughout 2023 only cater to the first part of our broader FA Roadmap plan. During 2023-2024, our FA Roadmap Councils will work to complete a full cycle of Roadmap activity by engaging and collaborating with industry vendors and leading academic labs in pursuit of potential solutions to the various technical challenges identified. This will be a significant endeavor, so I would like to encourage all interested parties and potential enablers to reach out now so we can start to discuss the strategies required to ensure the second phase of the FA Roadmap is as successful as possible. I would like to take this opportunity to thank all of the FA Roadmap Technical Committee Members, Council Chairs, and Mentors for their commitment and contributions. Your investment in this program is greatly appreciated. ABOUT THE COVER All images are from the 2021 EDFAS Photo Contest. Images and captions have been edited from original submitted entries. Top left: This photo looks like a tree planted on a pile of rocks, but these are dendrites formed due to moisture getting inside the package and reactingwith aluminumpads. Photo by JoanaMarieQ. Kintao, AnalogDevices, Second PlaceWinner, Color Images. Top right: Optical photo of a brokenwedge that resembles Sleeping Beauty. Photo by Krizalyn Oligario, Analog Devices, Third Place Winner, Color Images. Bottom: Nondestructive visualization of the interior of smartphone camera lens module, in its assembled state, using x-ray computed tomography (CT). The CT reconstruction was performed by a deep learning algorithm using 1200 radiographic projections acquired with an x-ray microscope. Voxel size = 7.5 µm. Photo by Herminso Villarraga-Gómez, Zeiss, Third Place Winner, Black and White Images.
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