edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 58 GUEST COLUMN EDFAS FA Technology Roadmap and underscores why it serves our community so well. As you may recall, the ASM and the International Symposium for Testing and Failure Analysis (ISTFA) Organizing Committees recently established the FA Technology Roadmap at the direction of the EDFASBoard. Themandate is comprised of two parts: 1) to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis and 2) to engage with both equipment providers and academic labs in an effort to review and pursue potential solutions to these technical challenges. To best serve the community, the FA Roadmapwas restructured to establish three Councils: Die-Level Roadmap Council (DLRC), Package Innovation Roadmap Council (PIRC), and an FA Future Roadmap Council (FAFRC). To incorporate a common FA workflow, the DLRC will host two separate domain teams: Isolation and Post-IsolationDomain. Over the past two years, these What do you think about when asked to describe electronic device failure analysis? Most will likely take a deep breath and pause as their thought process rapidly expands from the subtle intricacies of a specific technical area of interest to the multifaceted layers of a much broader landscape in which collaboration and workflow considerations dominate. There are many aspects of electronic device failure analysis which are siloed and self-contained and there are many which overlap with a few nearest neighbors within their scope of work. Yet, there exists a common thread which binds us all together and that is the pursuit of continuous improvement. We all need enhanced resolution, scaled sensitivity, and continuous development and innovation to keep pace with a powerhouse semiconductor industry as it accelerates toward angstrom-level transistor technologies and advanced 3D packaging architectures. This fundamental requirement to better our capabilities forces us to benchmark our respective abilities at regular cadence so that we can critically evaluate the current challenges we face and look for potential solutions. This is the very essence of the THE EDFAS FA TECHNOLOGY ROADMAP— FOUNDATION AND FUTURE Keith Serrels, NXP Semiconductors keith.serrels@nxp.com Fig. 1 FA Roadmap Council members Serrels
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