edfas.org 57 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 the tip-tilt table integratedwith the precision x-y-z camera stage. When combined with the self-aligning SIL tip, the result is trouble-free SIL imaging. For more information, visit www.irlabs.com. HIGH VACUUM AFM SYSTEM FOR ATMOSPHERE-SENSITIVE RESEARCH The Park NX-Hivac high vacuum AFM system is ideal for academic and industrial customers who are interested in highly sophisticated failure analysis solutions in highly doped semiconductor processing where such tools are now required. The system allows failure analysis engineers to improve the sensitivity and repeatability of their AFMmeasurements through a high vacuumenvironment. Because high vacuummeasurement offers greater accuracy, better repeatability, and less tip and sample damage than ambient or dry N2 conditions, users can measure signal response over a wider dynamic range in failure analysis applications such as dopant concentration of scanning spreading resistance microscopy. The NX-Hivac enables materials scientific research that requires high accuracy and high-resolutionmeasurements in a vacuum environment free from oxygen and other agents. A complete NX-Hivac system includes Park’s unique design features such as closed-loop XY Scanner for accurate zoom-in imaging, low noise ratio (0.30 Å even when vacuumpump is on), increased tip lifetime, and the reliability of guaranteed repeatability. Special features such as software control for automatic pumping and venting, motorized laser alignment, and high-resolution axis-optics enhance the ease of use for operator. For more information, visit www.parksystems.com. TEST SOCKET FOR RAPID DEVICE BRING UP, CHARACTERIZATION, AND FA Smiths Interconnect announces its new Galileo test socket for area array and peripheral package tests. Galileo is an innovative, low-profile test socket engineered to support today’s high performance digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFNpackageddevices with extremely short lead times. Using a unique “universal” elastomer contact assembly, Galileo supports almost any standardpackage pinout, on any pitch (or multiple pitches) at > 0.35 mm, in any configuration, with no extra tooling charges. A single socket can be reused acrossmultiple pitches and pad/ball placement. In addition, no contact alignment or registration holes are required in the PCB, enabling quick and easy board integration. Galileo elastomeric test socket offers the following features: extremely short electrical paths to deliver excellent signal integrity, low inductance, high bandwidth beyond 40 GHz, high current capacity, very high thermal conductivity, field replaceable contact set, 3D printing technology for quick-turn socket body manufacture, prestocked elastomer sheets enabling very short lead-times, and solder down performance for applications where signal integrity is essential. For more information, visit www.smithsinterconnect. com. Galileo low-profile quick-turn test socket. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: Kelly Johanns, Business Development Manager 440.671.3851, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit.
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