edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 52 sales@ibselectronics.com www.ibselectronics.com/ic-failure-analysis Services Offered: Failure analysis, reliability, and environmental tests. Tools and Techniques: I/V characterization (curve trace), microprobing, optical microscopic examination, chemical or mechanical decapsulation, real time x-ray, scanning acoustic microscopy (C-SAM), scanning electron microscopy (SEM) systems, energy dispersive x-ray analysis (EDX), emission microscopy, hot spot analysis, chemical deprocessing, plasma etching, parallel lapping, cross sectioning, ball shear/bond pull, high temperature operating life, temperature humidity bias testing, high temperature operating life, highly accelerated stress bias testing (HAST), temperature cycling, preconditioning per JEDEC-A113, all levels, low temperature and high power burn-in, thermal shock, autoclave (pressure cooker) testing, high temperature storage, vapor phase/air, convection simulation,mark permanency, solderability, ESD, and latch up. INSCOPE LABS PTE. LTD. 11 Ubi Road 1, #07-01 Singapore 408723 +65 6779 3735 sales@inscopelabs.com www.inscopelabs.com/contact-us.htm Services Offered: Electrical fault localization, material analysis, and sample preparation. Tools and Techniques: Photon emission microscopy, multi-laser NIR scanning optical microscopy (1064 nm laser capable of electron-hole pair generation through backside silicon and 1340 nm laser high resolution thermal probe which allows localized heating), SEM and EDS analysis, topography contrast, grain size, surface structure, atomic contrast, phase analysis, elemental and chemical analysis, contamination analysis, x-ray analysis, Sonix scanning acousticmicroscope, sample preparation, mechanical polishing, chemical decapsulation, crosssection sample preparations (SEM and FIB), TEM sample preparations (mechanical polishing and focus ion beam (FIB), and sputter coating of sample (Au or Cr). MATERIAL SCIENCE SERVICES MSSCORPS CO. LTD. 1F & 8F, No.178, Section 2, Gongdao 5th Rd., Hsin-chu 300046, Taiwan, R.O.C. +886.3.666.3298 service@msscorps.com en.msscorps.com/ec99/rwd1521/category.asp?category_id=5 Services Offered: Materials analysis, IC circuit repair, failure analysis, and chemical engineering analysis. Tools and Techniques: 3D laser confocal microscope, AFM, FTIR, XPS, SIMS, cross-section polisher, SEM/ EDS, plasma FIB, DB FIB/EDS, TEM/EDS, FIB circuit edit (V400ACE, V600 +CE), TLP, THz-TDR, thermal EMMI (InSb), nano prober system, EMMI/InGaAs, OBIRCH, 2D 3D X-Ray, 3D OM, SAT, laser decap, and delayer. WATSON ANALYTICAL LLC 4795 Eastgate Mall, Suite 100 San Diego, CA 92121 858.761.2258 info@watsonanalytical.com www.watsonanalytical.com/about-us Services Offered: Electrical characterization, reliability test services, nondestructive testing, destructive testing, fault isolation, material characterization, and support services. Tools and Techniques: Passive microprobing, active microprobing (dc to 3GHz), RF/microwave coplaner probing (e.g. GSG, GS, probes), parametric measurements, pulsed I/V measurements, RF characterization, digital characterization, DC characterization, high temp operating life (HTOL), custom high temp operating life (HTOL), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), high temperature storage life (HTS), high humidity high temperature reverse bias (H3TRB), temperature cycle (TC), low temperature storage life, low power optical microscopy, high power optical microscopy, scanning acoustic microscopy, radiographic examination, optical measurements, decapsulation, sample potting/mounting, mechanical cross-section, mechanical delayering, reactive ion etching, photon emission microscopy, lock-in thermography, thermal mapping, externally induced voltage alteration (XIVA), thermally induced resistive change (TIVA), OBIRCH, soft defect localization (SDL), latent defect alteration (LADA), optical beam induced current (OBIC), electrical beam induced current (EBIC), passive voltage contrast, active voltage contrast, thermionic SEM, field emission scanning electron microscopy, and EDS. Visit the Electronic Device Failure Analysis Society website edfas.org
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