edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 50 of formal certification of electronics failure analysts and the curriculum around such certification. Views within our Society around these topics have been contentious, with passionate arguments made in support of both stances—to formulate an EDFAS Certification or not? The availability of certification for ourmemberswouldnot only enable alignment with existing credentials in the industry (e.g., test, NDE, and metrology), but these credentials would better clarify our involvement in a program and allow our members to better market their skill sets. With these activities, I can see EDFAS resonatingwith the rest of our industry, attracting newer members, and continuing to be crucial to our future.” Yan Li is currently a senior staff engineer in Corporate Quality Network of Intel Corp. located in Chandler, Ariz. Li received her Ph.D. degree in materials science and engineering from Northwestern University in 2006, and her M.S and B.S degrees in physics from Peking University in 1999 and 1996, respectively. Li has been actively involved in numerousmicroelectronic packaging related technical solutions and focusing on the quality and reliability of electronic packages, fundamental understanding of failuremodes and failuremechanisms of electronic packages, developing new tools and techniques for fault isolation and failure analysis of advanced electronic packages. Li is a senior member and contributor of many international professional associations, such as TMS, ASM International, and EDFAS. She has been appointed as TMS and ISTFA annual conference organizers since 2011. She joined the technical committee of International Symposium on the Physical and Failure Analysis of Inte- grated Circuits (IPFA) in 2018. She was granted the TMS EMPMD Young Leader Professional Development Award in 2014. Li has published over 20 papers and holds two patents in the microelectronic packaging area. She is the co-editor of a semiconductor industry highly recognized book, 3D Microelectronic Packaging by Springer. Vision Statement “EDFAS is the Society that can provide a diverse combination of electronic engineering, materials science and engineering, mechanical engineering, optics, physics, chemistry, computer science, along with a dedicated focus on electronic device failure analysis to scientists, engineers, and graduate students who perform failure analysis of advanced electronic devices. It provides a learning and sharing platformto professionals and graduate students working in this field. Meanwhile it also serves as a communication medium between semiconductor industry and tool vendors to develop innovative tools and techniques, expand FI-FA tool capability, and meet industry demands. It works for the continuous improvement of technology, device performance, and reliability in semiconductor industry. “Expanding the scope of EDFAS to newly emerging areas, like artificial intelligence, autonomous driving, Si photonics, and automation, can help our Society tomeet the ‘Big Data’ needs. Networking with other societies focusing on device testing, wafer or package process, materials analysis, quality and reliability of devices, and modeling can equip our professionals with knowledge and backgrounds they need to provide well rounded and in-depth failure analysis, thus driving problem solving and fixing. Investing in graduate students and attracting academia interests in failureanalysis techniques can foster talents and ensure a bright future for EDFAS.” Whether networking at events or accessing information through EDFA, ISTFA proceedings, or journals, our members have the edge. Now it’s time to introduce EDFAS to others in the industrywhowould like to take advantage of these careerenhancing benefits. Help us help the industry by expanding our membership and offering others the same exceptional access to information and networking that sets EDFAS apart. To reacquaint yourself with and introduce others to the EDFAS member benefits, visit asminternational.org/web/edfas/membership. EDFAS MEMBERSHIP
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