edfas.org 49 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 the conference, whether it be on a reviewor organizational committee, or as a paper tutorial contributor. I believewe should strive to keep EDFAS in the forefront of the failure analysis world and increase the sessions for emerging talent. EDFAS should continue to be the society people think of first as a source of failure analysis innovation sharing, training, and networking, and I will domy part as I strive to enablemember involvement and collaboration.” Chris Richardson has been working in the semiconductor and solar industries for 28 years in various roles, including electrical failureanalysis, designcircuit debug/ edit, analytical services, and failure analysis tool development. His failure analysis background was developed while working with various companies including, NCR, Symbios Logic, LSI Corp., Abound Solar, and now AlliedHigh TechProducts, where he is currently the X-Prep Product and Applications Manager. He received an M.S. in electrical engineering from the University of Colorado. Richardson’s volunteerism with EDFAS began in 2002 wherehe startedas an ISTFA tutorial organizing committee member and has served as a technical reviewer as well as being part of the EDFAS Board as a Member-at-Large. He has technical contributions to the ISTFA community with tutorials for “FIB—A Fault Isolation Design Repair Tool,” “Photovoltaic Failure Analysis,” “Failure Analysis Workflow,” and numerous technical papers. Vision Statement “As I have traveled the world over the last ten years, I have had the opportunity to interface with many different failure analysis labs, and more increasingly hardware forensic science labs. What I see is the need for the EDFAS organization to reach out beyond the semiconductor failure analysis world (IPFA, ESREF, and IPFA) and into more of the emerging fields of forensic science. The example I wouldgive pertains to thePAINE conference; it is an emerging conference that brings together experts from different industries with the goal of protecting hardware security. As an industry they are learning, their expertise in semiconductor failure analysis is low and are looking to improve. As a community and a committee (EDFAS) we could growby helping these types of conferenceswith our knowledge to help accelerate their learning. While this is only one example, I’m certain there are other emerging areas that could benefit more from the synergistic relationship we have to offer.” Bhanu Sood received bachelor’s and master’s degrees in mechanical engineering and metallurgy from the National Technical University of Ukraine, Kiev Polytechnic Institute, and a Ph.D. from the University of Maryland. In an engineering career spanning 25 years, he has worked with diverse teams in management and engineering capacities. Sood has developed electronics systems and led failure analysis, reliability evaluations, and risk assessments for adiverse set of enduses including space, avionics, military, automotive, medical, and telecommunication industries. Currently, as the chief engineer for the Quality and Reliability Division at NASA’s Goddard Space Flight Center at Greenbelt, Md., he serves as the chief technical adviser to Center leadership on technical matters related to mission support and the development of assurance disciplines. He has authored numerous articles and book chapters and has given lectures on analytical technology challenges in both micro- and nanoelectronics. He is the chair of the EDFAS Education Subcommitteewhere he leads efforts focusedon the identification of electronics failure analysis education delivery mechanisms and the development of educationprograms for the Society. Sood is an active contributor to industry volunteer consensus standards activities associated with failure analysis, electronics reliability, quality, and supply chain within SAE, IPC, and IEEE. Vision Statement “EDFAS continues to advance the practice and profession of failure analysis. Our volunteers andmembers have significantly raised both the value and visibility of the science of FA. As microelectronics are becoming increasingly complex and the interactionof supply chains intensify, ourmembers and failure analysts are required todeliver high quality results with speed, accuracy, and efficiency while technological challenges and business hurdles continue to slow innovation inour FA labs. As these challenges multiply, the need to fortify our educational offerings and build high-demand skills for our members is paramount. I will work with the EDFAS board to explore bold, fundamental changes in howwemeet the educational needs of our members. For example, I will continue to work with the EDFAS Education Subcommittee to drive the digitization of educational resources such as short courses and tutorials developed by the leaders in the FA industry, in order tomake these valuable products available to awider audience and for members to utilize between consecutive ISTFAs. In addition, we should explore the concept
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