edfas.org 47 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 4 TESCAN The complexity of Semiconductor Failure Analysis output requirements combined with changing architecture of integrated circuit packages, a decrease in the size of the package features, and emerging exotic materials create a huge technological challenge for any IC Packaging FA Lab. TESCAN is here to support its customers with Plasma FIB-SEMSOLARIS X and Large VolumeWorkflowdelivering thebenefits of Laser Ablation combined with the Plasma FIB-SEM. Get right to the core cause! tescan.com/products/fib-sem- for-semiconductors-tescan-solaris-x BOOTH 509 SIEMENS BOOTH 403 Tessent software accelerates defect identification and yield learning in digital semiconductor devices. It leverages volume scan diagnosis data to perform defect identification and guide failure analysis. Overview of Demonstration: Attendees will be introduced to the diagnosis flow and see how the collaboration between Siemens’ Tessent and PDF Solutions’ Exensio platform can be leveraged to improve accuracy of defect root cause paretos and die picking for FA. eda.sw.siemens.com TED PELLA INC. Ted Pella Inc. is a premier supplier of consumables and sample preparation tools and accessories for optical light microscopy and electron microscopy applications. We carry a wide range of preparation supplies, SEM sample holders, TEM grids, support films and calibration standards. We manufacture many of our own instruments, accessories, and tools for sample preparation under the PELCO brand name including the Dimpler and a family of Scribing & Cleaving equipment for semiconductor applications. tedpella.com/material-sciences_ html/electroics-semiconductor-overview.aspx BOOTH 813 ULTRA TEC ULTRA TEC presents the FLUID CONTROL SYSTEM (FCS)—an auto-dispense and collect system for up to three polishing fluids. FCS allows for precise fluid dosing and removal at the tool/ sample interface during milling and polishing. This ensures that effective machine vision remains possible throughout. Fluids supplied to the surface can be acclimated to the required processing temperature in conjunction with ASAP-1 IN SITU’S Thermal Heat/Cool Stage. ultratecusa.com BOOTH 703 THERMO FISHER SCIENTIFIC Thermo Fisher Scientific provides workflows for semiconductor failure analysis, characterization, metrology, and research labs to meet the needs of analog, MEMS, logic, memory, foundry, packaging, and display applications. Our solutions include automated, high-productivity TEM/TEM sample prep that provides zero-damage, low-z imaging and characterization; innovative chemical, electrical, and physical failure analysis; and compliance testing systems to localize subtle electrical issues that affect yield, performance, and reliability. thermofisher.com/us/en/home/ semiconductors.com BOOTH 306 CARL ZEISS MICROSCOPY ZEISS has the most comprehensive portfolio of high-resolution light, x-ray, electron beam, and ion beam microscopes in the industry and is a leading solution provider to the global semiconductor community. Solutions for failure analysis and characterization span across wafer fab and packaging applications. ZEISS delivers actionable information to meet the semiconductor industry’s challenges for next-generation devices. zeiss.com/semiconductor-microscopy BOOTH 805
RkJQdWJsaXNoZXIy MTMyMzg5NA==