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edfas.org 53 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 3 The systemprovides high throughput imaging over a very large areawith theWLI module, and nanoscalemetrology with sub-angstrom height resolution over the areas of interest using AFM. Defects of a patterned structure can be detected by comparing images of reference and target sample areas using high speed “hot spot detection,” a technique enabled by fast localization for defect sites for high resolution AFM review. The Park WLI module supports both WLI and phase shifting interferometry (PSI) modes. The PSI mode is enabledwith amotorized filter changer and the twoobjec- tive lenses canbe replacedautomatically by themotorized lens and supports objective lensmagnificationof 2.5x, 10x, 20x, and 50x, and features a 100x CMOS camera. Fusing complementary techniques, Park NX-Hybrid WLI is a comprehensiveautomatedmetrology system, pro- viding substantial cost savings over two separate systems. “Unlike legacy standalone WLI and AFM systems, Park NX-HybridWLI accomplishesmore, in a seamlessmanner, at drastically lower cost of ownership, creating a complete- ly holistic integrated tool,” comments Stefan Kaemmer, general manager for Park Americas. “With both tools on the samemount and fed by one EFEM, the systemcreates fully integrated and exchangeable data, reducing the ‘fab footprint’ and increasing throughput over a larger area.” Park NX-Hybrid WLI was developed for use in appli- cations requiring much higher resolution and accuracy beyond the capability of WLI alone, such as advanced chemical mechanical polishing (CMP) metrology and monitoring, dishing, erosion, and edge-over-erosion (EOE), film thickness, pillar height, hole structure, and die to die comparison. It will also be useful in advanced packaging applications including through-silicon via (TSV) and micro bump measurement redistributed layer (RDL) measurement and photo resist residue detection. The new Park NX-Hybrid is part of a series of hybrid metrologyproductsParkSystemsplans tooffer toenhance and improve the utilization of atomic force microscopy across a wide range of industrial and academic research applications. For more information, visit parksystems.com. PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG SEMICONDUCTOR TOOL COMBINES AFMWITH WHITE LIGHT INTERFEROMETRY Park Systems launched Park NX-Hybrid WLI, the first fully integrated system that combines atomic force microscopy (AFM) with white light interferometer (WLI) profilometry. WLI is a nondestructive, non-contact, optical technique used to generate 2D and 3Dmodels of surfaces and is now widely used for semiconductor production quality assurance. Park Systems introduces the Park NX-Hybrid WLI as a powerful semiconductor metrology tool that incorporates the best of AFM and WLI technolo- gies into one seamless system. “Park NX-Hybrid WLI introduces a total complemen- tary metrology solution for semiconductor applications requiring both large area scanning and nanoscalemetrol- ogy,” comments Ryan Yoo, executive VP, business devel- opment, Park Systems. “The revolutionary design and seamless integration of WLI and AFM emphasizes Park’s commitment to provide customer driven solutions, as nano metrology requirements for device manufacturers continue to increase.” The Park AFM in the integrated system is based on the Park NX-Wafer, an automated AFM system for semi- conductor and related devices, manufacturing in-line quality assurance, as well as research and development. Park NX-Hybrid WLI combines atomic force microscopy with white light interferometer profilometry.