August_EDFA_Digital

edfas.org 41 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 3 PREVIEW T he demand for higher performance and lower power-consumption microelectronic devices has driven the semiconductor technology to shrink continuously according to Moore’s Law. In nanotech- nology, a new set of disruptive development in device structures and novel materials was introduced, leading to defects causing semiconductor device failures that have become harder to detect. “Chasing Ever-smaller andMore Elusive Defects” naturally became the theme of the 48th International Symposium for Testing and Failure Analysis (ISTFA). Held in Pasadena, California from October 30 to November 3, this premiumconference formicroelectronic device failure analysis (FA) will be packaged with many innovative, informative, and social events, including the technical program, tutorials, keynote speech, panel dis- cussion, and user groups. The technical program is undeniably the core of ISTFA. This year failure analysts have submitted nearly ISTFA 2022 Zhigang Song, ISTFA 2022 General Chair IBM zsong@ibm.com 100 abstracts in 18 technical sessions. Fault isolation, FA process, andmicroscope sessions received themost sub- missions. Attendees will have the opportunity to learn the latest techniques andmethods toenhance their abilities to chase the small and elusive defects. The tutorial program is another informative event at ISTFA, where experts from different FA fields share their knowledge and experiences. Topics such as fault isolation, microscopy, package failure analysis, electrical probing, and yield will be covered. It is a great place for attendees to learn FA knowledge and techniques quickly, especially for junior engineers. This year, we have made the tutorial more concise. Each tuto- rial will last one hour. The tutorial presentations will be on Sunday, October 30, in three tracks. The ISTFA keynote speaker is Dr. Emmanuel Crabbé, IBM Fellow. Crabbé is responsible for defining the Technology Roadmap for the processors at the core of IBM’s POWER and Z Systems. After receiving his Ph.D. The Pasadena Convention Center.