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edfas.org 37 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 3 CONCLUSION This article demonstrated the application of a novel 3D x-ray system to address a number of existing limita- tions of x-ray imaging systems for emerging challenges in failure analysis and reverse engineering. The system is designed to acquire high resolution 3D images rapidly without limitations to sample size, making it an ideal tool for imaging packages, PCBs, and 300 mmwafers. Several challenging examples were demonstrated to be solved at high resolutions down to 0.5 µm, and at high speeds and high contrast. These included cracks in RDL, voids in organic substrate, and voids in TSV in 300 mm wafer. All images were clear of the beam hardening artifacts that currentlyplagueboth failure analysis and the growing field of reverse engineering. A roadmapwas developed for this tool to keep pace with the resolution and sample require- ments for future anticipated challenges that will emerge in heterogeneous integration, wafer-level (wafer-to-die and wafer-to-wafer) packaging, and reverse engineering. REFERENCES 1. S.H. Lau, et al.: “Non-Destructive Failure Analysis Technique with a Laboratory Based 3D X-ray Nanotomography System,” LSI Testing Symposium, Japan 2006. 2. C.Y. Liu, et al.: “High Resolution 3D X-ray Microscopy for Streamlined Failure Analysis Workflow,” IEEE IPFA Conference Proceedings, 2016. 3. Y. Li, et al.: “High Resolution and Fast Throughput-time X-ray ComputedTomography for Semiconductor Packaging Applications,” Conference Proceedings from the 64th Electronic Components and Technology Conference (ECTC), 2014. 4. P.J. Withers, et al.: “X-ray Computed Tomography,” Nature Reviews Methods Primers, 1 (1), 2021, p. 1-21. 5. N. Asadizanjani, et al.: “Non-destructive PCB Reverse Engineering Using X-ray Micro Computed Tomography,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2015. 6. J. Glinz, et al.: “Metal Artifacts in Attenuation and Phase Contrast X-Ray Microcomputed Tomography: A Comparative Study,” Exp. Mech., 2022, https://doi.org/10.1007/s11340-022-00835-9. 7. R.M. LaVoy, F. Babian, and A. Reid: “Advanced X-Ray Inspection Techniques for IC Reverse Engineering,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2016. 8. U.J. Botero, et al.: “Automated Via Detection for PCB Reverse Engineering,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2020. ABOUT THE AUTHORS S.H. Lau has over 20 years of experience inmicroscopy, material characterization, and instrumen- tation in applications such as semiconductor failure analysis, material science, geoscience, and tissue engineering. A regular presenter at many international conferences, he has also published several papers in failure analysis, material characterization, and imaging in the field of x-raymicroscopy. Lau is the vice president of business development of Sigray Inc. Sheraz Gul is a systems engineer at Sigray working on the development of micro and phase contrast XRM systems. He received his Ph.D. in physical chem- istry from the University of California Santa Cruz where he worked on the syn- thesis and x-ray spectroscopic studies of doped semiconductor quantum dots. Jeff Gelb is the applications manager at Sigray. He began his career by working with x-ray dif- fraction instrumentation while completing a physics degree at UC Santa Barbara. He then became interested in multiscale x-ray tomography through his work at Xradia and later, ZEISS. Tianzhu Qin has been an application scientist at Sigray since 2021 developing proprietary image processing routines for 3D x-ray systems and a guest scientist at the Argonne National Laboratory for R&D projects and collaborations. Guibin Zan is a postdoc at Stanford Synchrotron Radiation Lightsource of the SLAC National Accelerator Laboratory, Stanford University. His research interests include all aspects of image processing and imaging, particularly with applica- tions inmicro array anode structured target source, Monte Carlo simulation, x-ray source, and x-ray grating interferometry for imaging and metrology. (continued on page 40)