August_EDFA_Digital

edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 3 22 Md. Tahsin Mostafiz is a Ph.D. student in electrical and computer engineering at University of Florida. He received his B.S. in electrical and electronics Engineering in 2017 from Bangladesh University of Engineering and Technology (BUET). His research interest includes deep learning, computer vision, and hardware security. Navid Asadizanjani received a Ph.D. degree inmechanical engineering from University of Connecticut in 2014. He is currently an assistant professor with the Electrical and Computer Engineering Department at University of Florida, Gainesville. His current research interest is primary on physical attacks and inspection of electronics. This includes a wide range of products from electronic systems to devices. He is involvedwith counterfeit detection and prevention, systemand chip-level reverse engineering, and anti-reverse engineering. NOTEWORTHY NEWS ITC 2022 The International Test Conference (ITC) will be held September 26-29 at Disneyland in Anaheim, Calif. ITC is the world’s premier conference dedicated to the electronic test of devices, boards, and systems covering the complete cycle from design verification, test, diagnosis, failure analysis, and back to process and design improvement. At ITC, test and design professionals will confront the challenges the industry faces and learn how these issues are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. ITC is sponsored by the IEEE. For more information, visit itctestweek.org. ESREF 2022 The 33rdEuropeanSymposiumonReliability of ElectronDevices, Failure Physics andAnalysis (ESREF 2022) will take place September 27-29 in Berlin. This international symposium has a focus on reliability in all aspects of electronics including new applications in extremely harsh environments such as space, transport, energy conversion, and smart functions. It provides the leading European forum for developing all aspects of reliability management and innovative analysis techniques for present and emerging semiconductor applications. For more information, visit esref2022.sciencesconf.org. IMAT 2022 International Materials, Applications & Technologies (IMAT) Conference & Exposition will be held September 12-15 in New Orleans, La. This unique event will feature core programming fromASMAffiliate Societies, whichwill serve as the backbone of IMAT techni- cal sessions. The EDFAS Society will feature five Tutorial sessions including Transmission Electron Imaging and Diffraction in the SEM: What, Why, and How You Can Do This in Your Microscope; Chip Scale Packaging and Its Failure Analysis Challenges; and Package Level Fault Isolation. Join your fellow EDFAS members at THE materials event. Learn more or register now by visiting imatevent.org.