August_EDFA_Digital

edfas.org 1 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 3 DEPARTMENTS Supervised Feature Extraction and Synthesis of IC Micrographs for Physical Assurance Md. Mahfuz Al Hasan, Md. Tahsin Mostafiz, and Navid Asadizanjani This article scrutinizes a few challenges of an end-to-end Trojan detection systemand presents probable solutions. Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 12 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2022 | VOLUME 24 | ISSUE 3 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Emmanuel Crabbé 41 SPECIAL ISTFA 2022 PREVIEW Zhigang Song 44 ISTFA EXHIBITORS LIST 45 2022 PHOTO CONTEST 46 2022 VIDEO CONTEST 47 DIRECTORY OF FA PROVIDERS Rosalinda Ring 49 TRAINING CALENDAR Rosalinda Ring 51 LITERATURE REVIEW Michael R. Bruce 53 PRODUCT NEWS Ted Kolasa 55 GUEST COLUMN Steven Herschbein 56 ADVERTISERS INDEX Electrical Characterizations Based on AFM: SCM and SSRMMeasurements with a Multidimensional Approach R. Coq Germanicus and U. Lüders The value of the AFM-based electrical modes for the characterization of a complex microelectronic structure is described. 24 For the digital edition, log in to edfas.org , click on the “News/Magazines” tab, and select “EDFA Magazine.” Impacts of Nested Variance Components on Semiconductor Electrical Test Sampling David Potts, Scott Hildreth, and Binod Kumar G. Nair A look at the nested variance structure under which different physical mechanisms will exhibit sensitivities to site-to-site, wafer-to-wafer, and lot-to-lot levels of variation, using Monte Carlo simulations to demonstrate the impacts these components can exert on perceptions of WET performance. 12 4 High Speed X-ray Tomography with Submicron Resolution for FA and Reverse Engineering of Packages, PCBs, and 300 mmWafers S.H. Lau, Sheraz Gul, Jeff Gelb, Tianzhu Qin, Guibin Zan, Katie Matusik, David Vine, Sylvia Lewis, and Wenbing Yun Application of a novel 3D x-ray system to address a number of existing limitations for emerging challenges in failure analysis and reverse engineering. 32 ABOUT THE COVER Backside through-silicon image of an ultrathinned flip chip processor device, viewed directly on the ASAP-1 In Situ Precision Mill and Polishing Machine stage with the system’s on-board front 45° process camera and illuminated by NIR LEDs. Photo by TimHazeldine, Ultra Tec Manufacturing Inc., First PlaceWinner in False Color Images, 2021 EDFAS Photo Contest. 24 32