August_EDFA_Digital

A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2022 | VOLUME 24 | ISSUE 3 ELECTRONIC DEVICE FAILURE ANALYSIS edfas.org NESTED VARIANCE COMPONENTS AND SEMICONDUCTOR TEST SAMPLING ELECTRICAL CHARACTERIZATIONS BASED ON AFM HIGH SPEED X-RAY TOMOGRAPHY WITH SUBMICRON RESOLUTION FEATURE EXTRACTION AND SYNTHESIS OF IC MICROGRAPHS FOR PHYSICAL ASSURANCE 4 24 12 32