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edfas.org 51 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 GUEST COLUMN council. The combined experience of council members is easilymore than 400 years! The first and foremost step for our councils is to identify the various technical challenges and gaps affect- ing our labs today. The councils have beenmeeting at a regular cadence to debate and discuss the challenges, alongside determining the criticality of gaps and chal- lenges. Each council is focusing on specific themes to ensure breadth and adequate coverage of various topics that matter. Each theme has subject matter experts who candive deep into the challenges. For example, theDLRC’s isolation domain team identified several themes, includ- ing fault isolation, product yield, test, and diagnostics. And the DLRC’s post-isolation domain group is focusing onmicroscopy, scanning probemicroscopy, nanoprobing, and circuit edit. For the PIRC, the themes in the spotlight are packaging, assembly, 3D devices, and board-level FA. The FAFRC, as the name implies, focuses on upcoming F ailure analysis has become a critical enabler of semiconductor technology innovations. The logic and memory scaling continues at an unabated pace with new materials and transistor architectures being introduced. The integration of advanced packaging heterogeneous technologies like chiplets, 2.5D, and 3D in mainstream devices is exploding. The complexity of FA tasks is further compounded by the fact that during the new technology development phase, the necessary process for isolating and finding defect considerations is generally an afterthought and not accounted for in design, causing a few bumps in the road ahead. To address these challenges, a new industry-wide FA Technology Roadmap was created and approved by the EDFAS Board in 2020. The roadmap framework is estab- lishedaround three councils: aDie-Level RoadmapCouncil (DLRC), a Package Innovation Roadmap Council (PIRC), andanFAFutureRoadmapCouncil (FAFRC). Thesecouncils have been fully staffed with expert volunteers from logic, memory, IDMs, foundries, and research organizations. We are very excited to have varied and deep expertise in each THE EDFAS FA TECHNOLOGY ROADMAP — ADVANCING OUR COMMUNITY Nicholas Antoniou, PrimeNano Inc. nicholas@primenanoinc.com Fig. 1 FA Roadmap Council Members Antoniou