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edfas.org 49 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 the feature is automaticallymeasured inaccordancewitha “recipe” that has been set up. In the second instance, once multiple features in an initial image have beenmeasured, the same features can bemeasured in subsequent images with a single click. The system automatically adjusts for misalignment among the images. The third and newest level of automation allows engineers to automatically characterize an entire folder of images. For more information, visit quartzimaging.com. Trench measurements done using Quartz PCI-AM Version 8. HITACHI ARBLADE 5000 BROAD ION MILLING SYSTEM Hitachi introduces themost advanced broad ion beam system for producing exceptionally high-quality cross- section or flat-milling samples for electron microscopy. The ArBlade 5000 is equipped with a fast-milling Ar ion gun with a milling rate twice as high for cutting-edge performance, thus dramatically reducing the processing time for cross-section preparation. The ArBlade 5000 can cross section widths up to 8 mm. For large-area milling requirements such as elec- tronic-device applications, a revolutionary cross-section milling holder design has been developed for wider-area fabrication. The all-new ion-milling system is equipped with both cross-section milling and flat milling modes for the most complex application needs. Equipped with multiple holders, the ArBlade 5000 system accommodates a wide range of applications. Cross-section milling is used to produce wider, undistorted cross sections without apply- ing mechanical stress to the sample, while flat milling is useful for removing surface layer artifacts and final polish after traditional mechanical polishing techniques. Cryogenic versions of the ArBlade 5000 provide active cooling of the cross-section milling stage during sample processing. An integrated liquid nitrogen dewar con- nected to the cross-section stage effectively removes heat induced during ion-beammilling from the shieldingmask and sample. The digital Cryo Temperature Control (CTC) unit allows operators to set a desired cooling temperature by placing a heater and sensor directly at the cross-section shield- ing mask so that a desired process temperature can be accurately maintained. At the conclusion of cryo-milling, the specimen stage is gently warmed up to room temperature in order to avoid ice formation or water condensation on the sample surface. Samplecoolingcansupport damage-freecross-section milling of highly temperature-sensitive specimen such as polymers or soft metals. The ArBlade 5000 with CTC provides high ion-beam currents even at lower “gentle” accelerating voltages and is, therefore, optimally suited for this and other processing techniques. Formore information, visitwww.hitachi-hightech.com .