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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 48 structures over time (4D). By leveraging RaaD, the Xradia Versa maintains highest resolution across large working distances, accommodating both sample, environmental chamber, and high precision in-situ load rigs without sac- rificing resolution. The Versa seamlessly integrates with other Zeiss microscopes to solve multiscale correlative imaging challenges. For more information, visit zeiss.com/microscopy/us/ home.html. QUARTZ ADDS ADVANCED SEMICONDUCTOR METROLOGY FUNCTIONS TO ITS PCI MEASUREMENT SOFTWARE Quartz’s new automated measurement (AM) module adds advanced semiconductormetrology functions to the Quartz PCI software that automate featuremeasurements in electron microscope images. Unlike tools designed for in-line metrology using top view images such as CD-SEMs, PCI AM is particularly well suited for measuring semiconductor features in cross- section and top view images from SEMs (X-SEM) and TEMs in laboratory, process development, and engineer- ing environments. Multiple edge detection techniques are employed depending on the nature and source of the image. Tools are provided for automaticallymeasuring layers, trenches, pillars, lines, spaces, complex features, and 2D shapes, such as contact holes and vias. Within these fea- tures, it is possible to measure widths and heights (criti- cal dimensions), sidewall and center angles (in multiple regions), edge roughness, linewidth roughness, and other geometric properties. Threedifferent edgedetection techniques areavailable allowing analysis of both SEM and TEM images. Noise- reduction filtering is also available to improve resultswith noisy images. A setting is also available that causes the standard Quartz PCI image measurement tools to snap to the detected edges. The systemoffers three levels of automation. In the first instance, engineers simply click inside adevice feature and PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG XRADIA VERSA 3D X-RAY MICROSCOPES POWERED BY ARTIFICIAL INTELLIGENCE TheXradia610&620Versadeliversnondestructive sub- micron scale microscopy of intact samples, provides true spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm, higher flux and faster scans without compromising resolution, in situ imaging for nondestruc- tive characterization of microstructures in controlled environments andover time, giving high throughput while maintaining excellent image quality. Where traditional tomography relies on single-stage geometric magnification, Xradia Versa features a com- bination of unique two-stage magnification optics and a high flux x-ray source to produce faster submicron scale resolution images. The Resolution at a Distance (RaaD) architecture enables high resolution 3D imaging of larger, denser objects including intact components and devices. The optional flat panel extension (FPX) enables rapid scans of very large samples (up to 25 kg), allowing navigation to interior regions of interest. Zeiss Xradia 600 Series Versa can nondestructively characterize the 3Dmicrostructure ofmaterials under con- trolledperturbations (in situ) andobserve the evolutionof Zeiss Xradia 620 Versa 3D x-ray microscope.