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edfas.org 47 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 NOTEWORTHY NEWS IEDM 2022 The 68th International Electron Devices Meeting (IEDM) will be held this year on December 3-7 at the Hilton San Francisco Union Square. IEDM is a leading forum for reporting breakthroughs in the technology, design, manufacturing, physics, and modeling of semiconductors and other electronic devices. Topics of interest include circuit and device interactions; characterization, reliability, and yield; compound semicon- ductor and high-speed devices; memory technology; modeling and simulation; nano device technology; optoelectronics, displays, and imagers; power devices, process and manufacturing technology, and sensors, MEMS, and BioMEMS. IEDM is sponsored by the IEEE Electron Devices Society. For more information, visit ieee-iedm.org/future-conferences and watch for any updates to the meeting plan. • M.H. Thor, S.H. Goh, B.L. Yeoh, et al.: “Dynamic Resistance Variation Mapping Technique for Defect Isolation,” Microelectron. Reliab., 2021, 119, p. 114069. • J. Wang, F. Sciarrino, A. Laing, et al.: “Integrated Photonic Quantum Technologies,” Nat. Photonics, 2019, 14, p. 273. • Q. Wang, W. Liu, L. Gong, et al.: “Determination of Doping Concentration of Heavily Doped Silicon Wafers using Photon Reabsorption in Photocarrier Radiometry,” AIP Advances, 2020, 10, p. 035118. • X. Wen, S. Adhikari, C.L. Cortes, et al.: “Ghost Imaging Second Harmonic Generation Microscopy,” Appl. Phys. Lett., 2020, 116, p. 191101. • B. Xu, Z. Wang, and J. He: “Beating the Rayleigh Limit via Aperture Modulation,” J. Opt., 2021, 23, p. 015701. • Y. Yang, P.M. Souare, and J. Sylvestre: “Using Confocal Microscopy and Digital Image Correlation to Measure Local Strains Around a Chip Corner and a Crack Front,” IEEE Trans. Device Mater. Reliab., 2020, 20, p. 97. • N. Zaraee, B. Zhou, M.S Ünl , et al.: “Gate-Level Validation of Integrated Circuits with Structured- Illumination Read-Out of Embedded Optical Signatures,” IEEE Access, 2020, 8, p. 70900. • B. Zhou, A. Aksoylar, M.S Ünl , et al.: “Hardware Trojan Detection Using Backside Optical Imaging,” IEEE Trans. CAD Intgr. Circ. Sys., 2021, 40, p. 24.