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edfas.org 43 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 info@maser.nl www.maser.nl Services Offered: Failure analysis and reliability test, nondestructive analysis, construction analysis, FIB circuit edit service, advanced failure analysis, IPC inspections, qualification test, ESD & latch-up test, environmental test, mechanical test, HALT test, IP test, electrical test, and optical test. Tools and Techniques : Curve tracing, decapsulation, conventional cross-sectioning, de-layering: layer by layer removal by fine polishing or etching to reach the area of interest,micro-probing: on-chipmeasurement of voltages, optical microscopy, SEM, emission microscopy, optical beam induced resistance change (OBIRCH), lock-in ther- mography (LIT), AFM, focused ion beam cross sectioning, 3D optical microscopy, x-ray analysis (2D & 3D), SAM, 3D LIT, mechanical cross sectioning by precision sawing/ grinding and polishing, SEM inspection and EDX material analysis, and comprehensive FA report. MICROTECH LABORATORIES LLC 538 Haggard St., STE 402 Plano, TX 75074 972.633.0007 contact@fa-mal.com microtechlaboratories.com Services Offered: Turnkey failure analysis, device analysis, material characterization, reverse engineering, component analysis, PCBA analysis, design debug, and consulting and training. Tools and Techniques: FIB, SAM, SEM/EDX, photoemis- sion microscopy (PEM/EMMI), liquid crystal, real-time x-ray, reverse engineering-construction analysis, decap- sulation, cross-section, backside sample preparation, product teardowns, circuit extractions, GDSII layouts, wet decapsulation using acid jet fuming nitric and/or fuming sulfuric acid, die decapsulation using heat or mechani- cal techniques, layer-by-layer deprocessing to substrate using wet etching and/or dry etching techniques, FIB design repair, probe pad deposition and circuit isolation, mechanical probing of internal nodes, nondestructive inspection of wire bond, solder bump, and PCB. MUANALYSIS INC. 2301 St. Laurent Blvd., Suite 500 Ottawa, Ontario Canada K1G 4J7 613.721.4664 info@muanalysis.com muanalysis.com/contact-us Services Offered: Level 1, 2, 3 failure analysis, material analysis, fabrication support, reliability testing and reli- ability analysis, teardown analysis, and training. Tools and Techniques: Real-time x-ray, C-SAM, decap- sulation and package opening, visual inspection includ- ing optical microscopy and laser scanning microscopy (LSM), pin testing, static DC biasing, liquid crystal fault isolation, emission microscopy (EMMI), optical beam induced current (OBIC), backside emission microscopy, various optical techniques for fault isolation, delayering or cross-sectioning, SEM, microprobing with picoprobes, BGA layer by layer construction analysis, FTIR spectros- copy, Raman spectroscopy, SEM, EDX spectroscopy, x-ray imaging, disjointment andRoHS screeninganalysis, MAJIC (muanalysis joint integrity characterization), counterfeit detection, andconfocal laser scanningmicroscopy (CLSM). PRIORITY LABS 1251 S Sherman Street STE 109 Richardson, TX 75081 214.926.7523 info@prioritylabs.com Services Offered: Counterfeit IC detection, IC failure analysis, and material analysis. Tools and Techniques: Decapsulation, dye and pry, time domain reflectometry, electrical characterization, scanning acoustic microscopy, FIB, cross-sectioning, and deprocessing. SEMION LLC 1055 NE 25th Ave., Suite H Hillsboro, OR 97124-4901 503.332.9668 info@semionco.com semionco.com/applications-and-analytical-services ServicesOffered : Applying FIB, SEMand TEM for analysis, measurement and fabrication services for full 300 mm semiconductor wafers and pieces, materials samples and biological specimens. Tools and Techniques: Expida dualbeam SEM-FIB, high resolution SEM/STEM imaging, backscatter electron (BSE) detection for material-related contrast, low-energy secondary electron detection for topographic data, and scanning transmission electron microscopy (STEM) to reveal contrast otherwise not visible between materials, FIB cross sectioning and imaging, high resolution TEM imaging, SEM-FIB TEM sample preparation, x-ray micros- copy, tomography or analysis (EDS, EBSD), EDS elemental analysis, probe milling for device edit and fabrication, sharpen or customize AFM and other probes or filaments for optimum performance.