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edfas.org 37 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 NOTEWORTHY NEWS IPFA 2022 The 29th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) will be held as a hybrid event on July 18-21. The live portionwill be based at Marina Bay Sands, Singapore. The event will be devoted to the fundamental understanding of the physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and newCMOS devices, in turn resulting in improved know-howof the physics of device, circuit, andmodule failure that serves as critical input for future design and reliability. The symposium is technically cosponsored by the IEEE Electron Device Society and IEEE Reliability Society. For more information, visit the IPFA website at https://www.ipfa-ieee.org/2022. MICROSCOPY &MICROANALYSIS MEETING 2022 The Microscopy & Microanalysis (M&M) 2022 meeting will be held July 31 – August 4, in Portland. The scientific program features the latest advances in bio- logical, physical, and analytical sciences as well as techniques and instrumentation. Complementing the program is one of the largest exhibitions of microscopy and microanalysis instrumentation and resources in the world. Educational opportuni- ties include a variety of Sunday short courses, tutorials, workshops, and pre-meeting congresses for early-career scientists. The opening reception offers a networking venue for meeting newpeople in the field and renewing old acquaintances, while the Monday morning plenary session showcases talks from outstanding researchers and recognizes major Society and meeting award winners. In addition, daily poster awards will highlight the best student posters in instrumentation and techniques as well as biological and physical applications of microscopy and microanalysis. M&M is sponsored by the Microscopy Society of America, the Microanalysis Society, and the Microscopical Society of Canada. For more information, visit microscopy.org/MandM/2022. ITC 2022 The International Test Conference (ITC) will be held September 26-29 at Disneyland in Anaheim, Calif. ITC is the world’s premier conference dedicated to the electronic test of devices, boards, and systems covering the complete cycle from design verification, test, diagnosis, failure analysis, and back to process and design improvement. At ITC, test and design professionals will confront the challenges the industry faces and learn how these issues are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. ITC, the cornerstone of TestWeek events, offers a wide variety of technical activities targeted at test and design theo- reticians and practitioners. The conference includes paper sessions, keynotes, tutorials, case studies, and commercial exhibits and presentations, and a host of ancillary professional meetings. ITC is sponsored by the IEEE. For more information, visit itctestweek.org .