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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/PrimeNano nicholas@primenanoinc.com Scott D. Henry Publisher Mary Anne Fleming Manager, Technical Journals Madrid Tramble Production Supervisor Joanne Miller Managing Editor Victoria Burt Contributing Editor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Szu Huat Goh Qualcomm Ted Kolasa Northrop Grumman Innovation Systems Rosalinda M. Ring Howard Hughes Research Labs LLC Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Paiboon Tangyunyong Sandia National Labs Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub- lished quarterly by ASM International ® , 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright©2022by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $160 U.S. per year. Authorization tophotocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registeredwith theCopyright ClearanceCenter (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly toCCC, 222 RosewoodDrive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. T he Women in Electronics Failure Analysis (WEFA) group gathered in person for the second time at ISTFA 2021 in Phoenix. The groupmet for the first time at ISTFA 2019 in Portland, Ore., and then online during the 2020 EDFAS Virtual Workshop. Recognizing that our lives have changed over the last two years, not only professionally, but personally, we wanted to sit, talk, and reconnect. About seventeen women andmen attended, introduced themselves, and sharedwhy theywere attending the conference. To put everyone at ease and make it lighthearted, we asked several icebreaker questions: How did your wardrobe change over the last year? Did you adopt a pet?What series did you bingewatch?What was your first post-pandemic vacation? What hobbies did you pick up? From a series of professional questions following our ice breakers, we learned that multiple attendees were deemed essential workers. This meant that they did not work from home but continued to work in their labs. That’s not to say that lifewasn’t different for these failure analysis engineers, it most certainly changed, as did many of our career outlooks. The goals for WEFA are to promote women in the failure analysis commu- nity, help themretain their jobs, network, and find other opportunities within it. Manywomen have employee resource groups at their own companies, but the failure analysis community is relatively small and thuswewant to facilitate additional networking occasions. Through personally inviting women at the ExpoHall, at least a dozenor so additional attendees joined theWEFAmeeting because they were approached one-on-one. ISTFA provides us great technical information and an opportunity to foster the engaged community, expand our influence, and connect with more indi- viduals. Within WEFA we strive to highlight each other’s skills and attributes so that we could think of each other the next time there’s a job opening, or the next time we’ve got a question. We got to know each other better in our session, bridging the gap from just attending a presentation next to a peer, to learningwho does failure analysis inmedical research, who is a circuit edit engineer, who is getting ready to retire, and so on. Nowwe canmore often say “I know someone in the industry I might be able to connect you with” when our companies are hiring, and specific FA skills are needed. To keep the momentum going, we exchanged emails and have recon- nected a couple of times with everyone who attended the session. We plan to do another virtual networking event before ISTFA 2022. Please join our LinkedIn group, Women in Electronics Failure Analysis (WEFA), as we’d like to hear your ideas for future topics, meetings, and activi- ties. WEFA does plan to meet again in person this fall at ISTFA 2022, and we hope to see you there. MAY 2022 | VOLUME 24 | ISSUE 2 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL CONNECTING WOMEN IN FAILURE ANALYSIS Renee S. Parente, AMD renee.parente@amd.com edfas.org Parente