May_EDFA_Digital

edfas.org 1 1 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 2 NOTEWORTHY NEWS ANADEF 2022 The 18th ANADEF Workshop will be held June 13 to 18, at Belambra Business Club, Seignosse-Hossegor (Landes), France. The conference addresses new issues related to the latest technological developments in electronic component failure analysis, presented through tutorials, plenary sessions, micro-workshops, as well as participation by equipment manufacturers and suppliers. ANADEF, a French nonprofit scientific society established in 2001, meets biennially to bring together industry experts and mechanism scientists concerned with the prevention, detection, and failure analysis of electronic components and assemblies. For more information, visit anadef.org. ESREF 2022 The 33rdEuropeanSymposiumonReliability of ElectronDevices, Failure Physics andAnalysis (ESREF 2022) will take place September 27-29 in Berlin. This international symposium has a focus on reliability in all aspects of electronics including new applications in extremely harsh environments such as space, transport, energy conversion, and smart functions. It provides the leading European forum for developing reliability management and innovative analysis tech- niques for semiconductor applications. For more information, visit esref2022.sciencesconf.org .