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edfas.org 49 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 LITERATURE REVIEW T he current column comprises peer-reviewed articles published since 2020 on thermography and thermal-related phenomena. Note that inclusion in the list does not vouch for the article’s quality and category sorting is by no means strict. If you wish to share an interesting, recently published peer-reviewed article with the community, please forward the citation to the e-mail address listed above and I will try to include it in future installments. Entries are listed in alphabetical order by first author, then title, journal, year, volume, and first page. Note that in some cases bracketed text is inserted into the title to provide clarity about the article subject. Peer-Reviewed Literature of Interest to Failure Analysis: Thermography and Thermal-related Phenomena Michael R. Bruce, Consultant mike.bruce@earthlink.net • S. Alajlouni, A. Beardo, L. Sendra, et al.: “Geometrical Quasi-ballistic Effects on Thermal Transport in Nanostructured Devices,” Nano Res., 2021, 14, p. 945. • K. Allison, M. Hallman, E.A. Koskelo, et al.: “Increasing the Speed of Frequency-domain, Homodyne Thermoreflectance Imaging,” Rev. Sci. Instrum., 2021, 91, p. 044901. • H.S. Cao and H.J.M. ter Brake: “[Review article:] Progress in and Outlook for Cryogenic Microcooling,” Phys. Rev. Applied, 2020, 14, p. 044044. • M. Ekpu: “Reliability Analysis of SnAgCu Lead- free Solder Thermal Interface Materials in Microelectronics,” Soldering Surf. Mount Technol., 2021, 33, p. 249. • F. Gucmann, J.W. Pomeroy, and M. Kuball: “Scanning Thermal Microscopy for Accurate Nanoscale Device Thermography,” Nano Today, 2021, 39, p. 101206. • S. Kyatam, D. Mukherjee, H. Neto, et al: “Thermal Management of Photonic Integrated Circuits: Impact of Holder Material and Epoxies,” Appl. Opt., 2019, 58, p. 6126. • D.U. Kim, J.D. Kim, I. Han, et al.: “Backside Thermal Fault Localization using Laser Scanning Confocal Thermoreflectance Microscopy Based on Auto- Balanced Detection,” IEEE Trans. Instrum. Meas., 2020, 69, p. 2914. • Y. Liu, B. Yang, S. Huang, et al.: “Thermo-mechanical Modeling of Stacked Die Flash Memory Package EMI Shielding Layer Crack under Thermal Cycling Test,” Microelectronics Reliability, 2021, 127, p. 114410. • Mazullah, M. Sadiq, M. Khan, et al.: “Thermal Aging Impact on Microstructure, Creep and Corrosion Behavior of Lead-free Solder Alloy (SAC387) use in Electronics,” Microelectron. Reliab., 2021, 122, p. 114180. • Y. Metayrek, T. Kociniewski. Z. Khatir, “Thermal Mapping at the Cell Level of Chips in Power Modules Through the Silicone Gel using Thermoreflectance,” Microelectron. Reliab., 2020, 105, p. 113563. • S. Sandell, E. Chávez-Ángel, A.E. Sachat, et al.: “Thermoreflectance Techniques and Raman Thermometry for Thermal Property Characterization of Nanostructures,” J. Appl. Phys., 2020, 128, p. 131101; Correction: J. Appl. Phys., 2021, 129, p. 029902. • T. Singh and R.R. Mansour: “Experimental Investigation of Thermal Actuation Crosstalk in Phase-Change RF Switches using Transient Thermoreflectance Imaging,” IEEE Trans. Electron Devices, 2021, 68, p. 3537. • D.-G. Zheng, D.-S. Shin, J.-I. Shim, et al.: “Measuring the Surface Temperature of Light-emitting Diodes by Thermoreflectance,” Jpn. J. Appl. Phys., 2021, 60, p. 052003. • A. Ziabari, M. Parsa, A. Shakouri, et al.: “Far-field Thermal Imaging Below Diffraction Limit,” Optics Express, 2020, 28, p. 7036.