February_EDFA_Digital

edfas.org 47 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Howard Hughes Research Labs LLC jmj4papa@yahoo.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. APPLIED BEAMS LLC 14855 SW Murray Scholls Dr. Beaverton, OR 97007-9711 503.608.7237 info@appliedbeams.com appliedbeams.com Services Offered: FIB-SEM consumables, upgrades and customizations, and FIB, SEM, and AFM Services. Tools and Techniques: SEM/EDX (CamScanTungsten, CamScan LaB6), HyperFIB micro-machining plasma focused ion beam (FIB) for cross-sectioning, full die delay- ering, and test probe refurbishing. EXPONENTIAL BUSINESS & TECHNOLOGIES COMPANY (EBATCO) NANO ANALYTICAL AND TESTING (NAT) LABORATORY SERVICES Ebatco Headquarters 10025 Valley View Rd., Suite 150 Eden Prairie, MN 55344 844.332.2826 info@ebatco.com www.ebatco.com Services Offered: Surface roughness and 3D topography, chemical testing, colormeasurements, contact anglemea- surements, glossmeasurements, liquid testing, mechani- cal testing, metallurgy, microscopy, particle size testing, pore size measurements, technical consulting, thermal testing, and tribological testing. Tools and Techniques: Differential scanning calorimetry (DSC), Ebatco’s JEOL 6610LV SEM is equipped with a Bruker XFlash 6|30 EDS, Fourier transform infrared (FTIR) microscopy, Raman microscopy, refractive index (RI) measurements, simultaneous thermal analysis of DSC and TGA (STA), thermogravimetric analysis (TGA), surface roughness analysis using atomic force microscopy (AFM), contact stylus, SEM, scanning probe microscopy (SPM), and white light interferometry, liquid turbidity, viscosity, surface/interfacial tension, density, microindentation, microscratch,modulusmapping, nano (dynamicmechani- cal analysis (DMA), nanoindentation, nanoscratch, laser diffraction, dynamic light scattering, Coulter principle, specific heat, thermomechanical analysis (TMA), friction, and wear. FIB-X 538 Haggard St. Suite 409-A Plano, TX 75074 214.473.6764 fib@fibx.com fibx.com Services Offered: Focus-ion beam (FIB) nanofabrication, FIB circuit edit, FIB cross-section and SEM imaging, real- time design verification and debug, SEM/EDX for defect analysis, 3DFIB-SEMvolume, andFIBXmovingmaps (MM). Tools and Techniques: FEI ThermoFisher Helios 660 G3, FEI Teneo SEM, FEI DB235 dual beam, DCG P3X circuit modification tool, Fischione Model 1060, decapsulation and encapsulation, sample preparation for backscattered electron imaging (argon ionmill), and large areaSEMmaps imaging (high resolution back scatter/BSE). HI-REL LABORATORIES 6116 N Freya Spokane, WA 99217 509.325.5800 ken.turner@hrlabs.com hrlabs.com Services Offered: Microelectronic failure analysis, destructive physical analysis of electronic components, SEM metallization inspection, metallurgy and materials analytical services, package construction analysis, and stand-alone prohibited materials analysis (PMA). Tools and Techniques: C-SAM, real-time x-ray, 3D-CT x-ray, scanning electron microscope (includes SEM pho- tography), SEM+ EDXS, FT-IR (Fourier transform infrared), focused ion beam (FIB) sectioning, optical microscopy, EDXRF, external/internal visual inspection, delid/decap, external/internal prohibited materials analysis (PMA), PIND, bond pull, hermiticity testing (fine and gross leak/ chld), residual gas analysis (RGA), die shear, cross-section, optical documentation inadetailed reportwith interpreta- tion of data, decapsulation of plasticmodules and plastic ICs (Dil B Novalak Plastics), laser ablation, dot identifica- tion, stand-alone prohibited materials analysis (PMA), printed wiring boards, dye and pry analysis for ball grid array (BGA), and multilayer boards.