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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 36 ISTFA 2021 PANEL DISCUSSION A SUMMARY OF THE ISTFA 2021 PANEL DISCUSSION: OVERCOMING THE CHALLENGES IN SYSTEM-IN-PACKAGE FAILURE ANALYSIS Yan Li,* Randy Mulder,** and Greg Johnson*** ISTFA 2021 Panel Discussion Organizers *Intel Corporation, Chandler, Ariz. — yan.a.li@intel.com **Si Labs, Austin, Texas— randy.mulder@silabs.com ***Zeiss, Poughkeepsie, N.Y. — greg.johnson@zeiss.com T raditionally, panel discussions are one of the highlights of the International Symposium for Testing and Failure Analysis (ISTFA). After about two years of virtual networking, ISTFA 2021 attendees were excited to see each other in-person and to attend the most interactive technical session of the conference. To align with the theme of ISTFA 2021, “Riding the Wave of System-in-Package (SIP),” the topic of panel discussions was “Overcoming the Challenges in System-in-Package Failure Analysis.” The panel discussion topic attracts lots of interests in the failure analysis community, which ensures engaged discussions and keeps us well-prepared for SIP failure analysis challenges. A panel with five experienced and eloquent experts with a diverse set of opinions and thoughts exposed the audience to various viewpoints and solutions on the topic. E. Jan Vardaman is the president and founder of TechSearch International Inc. which has providedmarket research and technology trend analysis in semiconduc- tor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor pack- aging and assembly. She served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. Deepak Goyal is the senior director of the Assembly and Test Technology Development and Manufacturing Failure Analysis Labs at Intel. His responsibilities include development of the next generationof analytical tools and techniques, defect characterization, fault isolation, and failure and materials analyses for assembly technology development and manufacturing and board and system- level failure analysis. Zhiyong Wang is the managing director of the Worldwide Failure Analysis Group at Maxim Integrated, which is nowpart of AnalogDevices. He previouslyworked at Intel as a senior failure analysis engineering manager before joining Maxim Integrated. He has extensive FA experience in digital, analog, and mixed signal devices used in a variety of industries such as automotive, indus- trial, healthcare, data center and cloud, and mobile and consumer electronics. Charles Odegard is a senior member of the technical staff in the Semiconductor Quality department at Texas Instruments. He draws from his expertise in materials science and silicon-packaging processes and designs to solve these root cause investigations. A recent highlight from his career was developing novel characterization methods that enabled TI’s migration to Cu wire bonding, and subsequent Cu bond reliability characterization to align with the AEC-Q006 automotive industry require- ments for qualifications. The 2021 panel featured five experts with diverse backgrounds.