February_EDFA_Digital

edfas.org 35 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 JOIN US AT ISTFA 2022 Looking back on ISTFA 2021, we had so many memo- rable moments, and gained experience in many areas for future improvement. We are now looking forward to ISTFA 2022, which will be held on October 30 to November 3, in Pasadena. The Organizing Committee, led by the new General Chair Zhigang Song, has already started planning for the conference. Now is the time to get your technical paper ready for the submission to ISTFA 2022. We are looking forward to seeing you all in sunny California. Congratulations to the following winners: ISTFA 2021 BEST PAPER: “Demystifying Unexpected Silicon Responses through User-Defined Fault Models (UDFM) and Failure Analysis” Lesly Endrinal, Qualcomm Technologies Inc. ISTFA 2021 OUTSTANDING PAPER: “Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope" Sean Oliver, University of Maryland; The MITRE Corporation ISTFA 2021 ATTENDEES’ BEST PAPER: “Pushing Failure Mode Stimulus to Overcome the Limitation/Boundaries of Soft Defect Localization Tools” Allan Norico, ON Semiconductor ISTFA 2021 BEST POSTER: “Accelerate Your 3D X-ray Failure Analysis by Deep Learning High Resolution Reconstruction” Allen Gu, Carl Zeiss Microscopy ISTFA 2021 OUTSTANDING POSTER: “Workflow Solution for Depth Resolved 3D NAND Critical Dimension Metrology” Mark Najarian, Thermo Fisher Scientific EDFAS 2021 PHOTO CONTEST WINNERS Congratulations to the following winners: Category I: Color Images 1st Kevin Awai, Raytheon 2nd Joana Marie Q. Kintao, Analog Devices Philippines Inc. 3rd Krizalyn Oligario, Analog Devices Philippines Inc. Category II: Black & White Images 1st Wentao Qin, ON Semiconductor 2nd Jason Silva, Maxim Integrated 3rd Herminso Villarraga-Gómez Category III: False Color Images 1st Tim Hazeldine, Ultra Tec 2nd Wentao Qin, ON Semiconductor 3rd Kevin Awai, Raytheon All winners received a recognition plaque or certifi- cate and a one-year ASM/EDFAS membership. Winning entries will be featured on the cover of this magazine during 2022 and also may be viewed on the EDFAS website. ISTFA SPONSORS & SUPPORTERS On behalf of the Electronic Device Failure Analysis Society (EDFAS) and the organizers of ISTFA 2021, we appreciate your generous sponsorship contribution and recognize your continued commitment in making the ISTFA Conference and Exposition an outstanding event! Sponsors Allied High Tech Products, Inc. BSET EQ Siemens Thermo Fisher Scientific ULTRA TEC Corporate Supporters Bruker Corporation Park Systems Teledyne Imaging Sensors ISTFA Organizing Partner ESD Association Media Sponsors EDFA eNews / EDFA Magazine

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