February_EDFA_Digital

edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 34 technology (or even those with just a passing interest) an opportunity to share information and discover avenues for future collaboration. This year, we had twoUser Group sessions on Tuesday to discuss the topics of Sample Preparation and System on Package. The other two User Group sessions hosted on Wednesday covered the topics of FIB and Contactless Probing andNanoprobing. Thanks to Anita Madan (Consultant) and Daminda Dahanayaka (GlobalFoundries), and their User Group committee team for all their effort and determination to make this year’s User Group sessions successful. An outstanding Panel Discussion on the conference theme “Riding the Wave of System-in-Package (SiP)” was organized by Panel Chairs Yan Li (Intel) and Randal Muller (Silicon Labs) with focus on the challenges in SiP failure analysis. Five invited field experts shared their viewpoints and solutions basedon theirwork experiences anddiverse backgrounds, which led to very engaging conversations among the panelists and the audience. This year, theRoadmapCommittee, ledbyKeithSerrels (NXP), has integrated the Roadmap elements intoboth the Panel Discussion and User Group sessions so our entire FA community can start to form dedicated discussions around developing a clear FA Technology Roadmap for the years to come. Please check out the ISTFA User Group and Panel Discussion presentations, which will be posted on ASM Connect under the ISTFA 2021 topics. ISTFA EXPO The ISTFA Expo has always been the exceptional venue for FA professionals to learn about the latest FA tools and services. Even with COVID-19 concerns, we had a total of 60 exhibits on the exhibition floor with experts providing live demonstrations. Many vendors showcased the latest developments on their tools to users and gathered infor- mation about users’ wish lists for the next generation of tools. After a year and a half of isolation, it was the perfect time to finally reconnect the tool suppliers and their users during this in-person conference. WEFA EVENT This is the third year that ISFTA hosted the Women in Electronics Failure Analysis (WEFA) event. Seventeen participants with broad backgrounds joined the event, sharing both professional and personal experiences. The group was so excited to get to know each other, and has already formed a LinkedIn group right after the confer- ence. Please check out the link https://www.linkedin.com/ groups/12317183 if you want to join the group. Thanks to Renee Parente (AMD) and Efrat Moyal (Zeiss) for moderat- ing the event. The year 2021 proved to be particularly challenging for hosting an in-person conferenceduring thepandemic. The ISTFA conference could not be a successful event without the hard work of many volunteers and those who served as the organizing committee members. In addition to the various chairs mentioned in previous sections, thanks also goes to Vice General Chair Zhigang Song (IBM), Past General Chair David Grosjean (Butterfly Network), Expo Chairs Becki Watt (Mentor Graphics, A Siemens Business) and Rose Ring (HowardHughes Research Labs), Audio/Visual Chairs Renee Parente (AMD) and Ted Kolasa (Northrop Grumman), University Chair (Academia) Navid Asadi (University of Florida), and International Chairs Szu Huat Goh (GlobalFoundries) and Vinod Narang (AMD). Last but not least, a big thanks to ASM International staff Kathy Murray and Lindy Good for helping the Organizing Committee throughout conference planning and taking care of all the logistics for the conference arrangements. ULTRA TEC demonstrated their equipment at the Tools of Trade Tour. ISTFA 2021 was a welcome return to in-person events.