February_EDFA_Digital

edfas.org 33 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 ISTFA 2021 HIGHLIGHTS Susan Li, ISTFA 2021 General Chair Infineon, San Jose, California susan.li@infineon.com EDFAAO (2022) 1:33-35 1537-0755/$19.00 ©ASM International ® T he 47th International Symposium for Testing and Failure Analysis (ISTFA) was successfully held in person from October 31 to November 4, 2021, in Phoenix. Thanks to the dedication of the Organizing Committee with great support from the ASM team, ISTFA 2021 had a total of 438 attendees participate in events including the Symposium, Keynote Speech, Tutorials, Panel Discussions, User Group discussions, and an Expo Floor featuring 60 exhibits with experts providing live demonstrations. This in-person conference is a first step for us to return to normalcy after a very long year and a half of lockdown, remote work, and video conferencing due to the COVID-19 pandemic. TECHNICAL PROGRAM The ISTFA Technical Program kicked off on Sunday, October 31, with two tracks of parallel sessions of tuto- rial presentations. This year we had a total of 16 tuto- rial presentations including two featured presentations on the topics of “Failure Analysis Techniques for 3D Technologies” by Ingrid De Wolf (IMEC) and “Focused- Ion-Beam Circuit Edit and Fault Isolation” by Steven Herschbein (Consultant). We also had one new tutorial on the topic of “Failure Analysis for Hardware Security” by Navid Asadi (University of Florida). Though some of the tutorials were presented through pre-recorded video, the participants were very engaged throughout the tuto- rial sessions. Thanks to the Tutorial Committee, led by Christian Schmidt (Nvidia) and Kristofor Dickson (NXP), we had very successful tutorial sessions to start off the conference. The ISTFA Keynote presentation was given by Ravi Mahajan, Intel Fellow and Lead Architect for Packaging Technology Architecture, Assembly & Test Technology. During his inspiring presentation on “AdvancedPackaging of Heterogeneous Integration,” the audience had an opportunity to learn about historical advanced packag- ing architecture development and continued significant changes in packaging technology over the past three decades; gain insight into increasing interest in advanced package architectures as compact, highperformance plat- forms; and understand the need for increased on-package bandwidth, integrationof diverse IPs frommultiple found- ries, and improvements in yield resiliency. Thanks to the hard work by Technical Program Chair Frank Altmann (Fraunhofer Institute for Microstructure of Materials and Systems IMWS) and a team of 36 session chairs and 98 reviewers, the ISTFA 2021 Symposium featured 82 high-quality oral and poster presentations and invited talks in two tracks. Artificial Intelligence (AI) applications for failure analysis are gaining momentum, and a total of six technical papers were presented this year covering different aspects in this growing area. ISTFA Best and Outstanding Papers were selected based on attendees’ votes for the papers nominated by the session reviewcommittees. Congratulations to the awardwinners (see page 35)! Each year at ISTFA, themost highly attended events are the User Group discussions, and this year was no excep- tion. The goal of these two-hour User Group discussions is to provide those who are involved in these areas of Ravi Mahajan from Intel Corp. delivered the keynote. ISTFA