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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 24 NO . 1 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/PrimeNano nicholas@primenanoinc.com Scott D. Henry Publisher Mary Anne Fleming Manager, Technical Journals Madrid Tramble Production Supervisor Joanne Miller Managing Editor Victoria Burt Contributing Editor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Szu Huat Goh GlobalFoundries Singapore Ted Kolasa Northrop Grumman Innovation Systems Rosalinda M. Ring Howard Hughes Research Labs LLC Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Paiboon Tangyunyong Sandia National Labs Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub- lished quarterly by ASM International ® , 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright©2022by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $160 U.S. per year. Authorization tophotocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registeredwith theCopyright ClearanceCenter (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly toCCC, 222 RosewoodDrive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. I t was with some apprehension about the turnout and participation at ISTFA 2021 that I made my plan to attend in person. Once there, all my fears and con- cerns just disappeared. From the moment the confer- ence opened with the general membership meeting, it became clear that we had surpassed a critical mass of attendees and, facemasks aside, the experience felt like a “normal” pre-pandemic ISTFA. For our international colleagues and others who could not travel to Phoenix, the organizers offered the opportunity to submit a pre-recorded presentation followed by live Q&A. This worked well in my experience, and I also noticed the attendance remained the same from live to pre-recorded presentations. In the end, allowing those who could not travel to present their work helped complete the program with valuable technical content. The keynote speaker, Ravi Mahajan, gave us a dizzying overview of the packaging technology roadmap at Intel. It has become hard, at times, to distinguish where the die ends and the package begins. Following on this theme, the Panel Discussion focused on system-in-package FA. Again, an engaging and lively panel discussion took place. The “Women in Electronic FA” group held their meeting in person again and shared their perspective and experiences in the industry. The User Group meetings also returned and were chock full of case studies and new developments from the suppliers. A big part of the ISTFA experience is visiting with the equipment suppliers on the expo floor, something that can only be done in person and was sorely missed last year. The expo returned to ISTFA in 2021 andwaswell represented by the industry. The Tools of the Trade tour, a preview the evening before the expo floor opens, sold out in advance, another sign of strength at this ISTFA. The show floor was busy not just at breaktime but throughout the day as the posters, keynote speaker presentation, WEFA meeting, and more were held on the show floor. What is an ISTFAexperiencewithout a social event?Wegatheredat Billiards &Bowling for games, drinks and food, and networking. Once again, this event felt like a pre-pandemic normal that was well attended and a lot of fun. To conclude, ISTFA 2021 was a resounding success and a clear sign of our resilience and ability to adapt to change, qualities required to succeed in the world of electronic device failure analysis. A heartfelt thank you goes out to the organizers who worked tirelessly to put together the program despite all the challenges they faced. In my experience as an audience member, the program did not miss a beat and it delivered on everything we expect from our annual ISTFA gathering. FEBRUARY 2022 | VOLUME 24 | ISSUE 1 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL ISTFA DURING THE PANDEMIC Nicholas Antoniou, PrimeNano Inc. nicholas@primenanoinc.com edfas.org Antoniou