November_EDFA_Digital

edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 4 60 Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: Kelly Johanns, Business Development Manager 440.318.4702, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit. Accelerated Analysis. ............................................ 60 Allied High Tech. .......................................30-31 / 43 ASM International. ............... 44 / Inside back cover Checkpoint Technologies................................20-21 Microsanj LLC........................................................ 53 OKOS. .................................................................... 43 Park Systems Inc............................................ 39 / 43 Quantum Focus Instruments. .............................. 49 Quartz Imaging Corp.. .......................................... 59 Siemens ......................................................... 11 / 43 Semicaps..........................................................40-41 Ted Pella........................................................... 3 / 43 TESCAN USA Inc........................... Inside front cover ULTRA TEC........................................Back cover / 43 For advertising information and rates , contact: Kelly Johanns, Business Development Manager 440.318.4702, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS ABOUT THE COVER All images are from the 2020 EDFAS Photo Contest and have been edited from original submitted entries. From left: • X-ray image depicting early transistor: 1951 Bell Labs original prototype of an A1698 point-contact transistor— marketed later by Western Electric as 2N22. Taken with a Zeiss Xradia 620 Versa x-ray microscope. Photo by Herminso Villarraga-Gómez, Carl Zeiss Industrial Metrology LLC, Black and White Images. • Dimensional metrology of a smartphone camera lens module using 3D x-ray volume reconstruction. Taken with a Zeiss Xradia 620 Versa x-ray microscope. Photo by Herminso Villarraga-Gómez, Carl Zeiss Industrial Metrology LLC, False Color. • Germanium oxide on bond wire. Photo by Jason Silva, Maxim Integrated, Black and White Images.