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edfas.org 53 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 4 • L. Xia, Z. Wen, K. Liao, et al.: “Unveiling the Failure Mechanism of Electrical Interconnection in Thermal-Aged PV Modules,” IEEE Trans. Device Mater. Reliab., 2020, 20, p. 24. • W. Yi, J. Chen, S. Higuchi, et al.: “Wafer-scale Analysis of GaN Substrate Wafer by Imaging Cathodoluminescence,” Appl. Phys. Express, 2019, 12, p. 051005. • J. Yin, E. Fathi, H.Z. Siboni, et al.: “Efficiency Degradation Induced by Surface Defects-assisted Tunneling Recombination in GaN/InGaN Micro- light-emitting Diodes,” Appl. Phys. Lett., 2021, 118, p. 021105. • C.G. Zimmermann: “Photoluminescence-based Detection of Mechanical Defects in Multijunction Solar Cells,” J. Appl. Phys., 2019, 126, p. 044503. • M. Yamaguchi, T. Kamioka, N. Kojima, et al.: “Defect Analysis of Crystalline Si Solar Cells by Learning Radiation-induced Defects in Si,” MRS Commun., 2021, 11, p. 272.