November_EDFA_Digital
edfas.org 43 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 4 ALLIED HIGH TECH PRODUCTS INC. BOOTH 801 For over 38 years, Allied High Tech Products has provided sample preparation products for microscopic evaluation to the microelectronics industry. Allied manufactures cutting-edge equipment at its California headquarters where all design, manu- facturing, and assembly takes place in-house to ensure the highest quality equipment is produced. Items on display include Allied’s state-of-the-art X-Prep Precision Polishing/Grinding/Milling Machine, MultiPrep Polishing System, and TechCut High and Low Speed Sectioning Saws. A range of consumable products will also be shown. alliedhightech.com Visit these key exhibitors and more at ISTFA '21 in the Exhibit Hall of the Phoenix Convention Center. Exhibition Hours: Tuesday, November 2 | 9:30 a.m. – 6:30 p.m. Wednesday, November 3 | 9:30 a.m. – 4:00 p.m. MENTOR (SIEMENS) BOOTH 710 The Tessent Operations products from Siemens EDA increase pro- ductivity during critical silicon validation and yield ramp phases. The products provide solutions for test bring-up, silicon characterization, diagnosis-driven yield analysis and failure analysis. Sophisticated machine learning based analysis eliminates diagnosis noise and accelerates the time to root cause of yield loss. With the introduc- tion of reversible scan chain diagnosis, resolution increases by 3X, accelerating FA efficiency. A new HP (high performance) option for Tessent SiliconInsight will be shown for ATPG pattern bring-up on devices with up to 330 pins. eda.sw.siemens.com ISTFA EXHIBITOR SHOWCASE OKOS OKOS is a premier manufactur- er of scanning acoustic micros- copy tools used for failure analysis and reliability testing. The VUE 250-P brings the power of nondestructive testing to you in a compact bench-top footprint. It is a must for semiconductor package integrity assessment. okos.com BOOTH 500 PARK SYSTEMS Park Systems continues to advance the scope of its products to enhance nanometrology in line with their mission to enable nanoscale advances for scientists and engineers solving the world’s most pressing problems. The advanced AFM architecture, the True Non-Contact mode and SmartScan technol- ogy embedded in Park Systems’s full line of products provides the highest degree of accuracy and advanced automation for today’s most demanding nanoscale applications. Research driven product innovations, accelerated at the rapid pace of nanotechnology, are the hallmark of Park’s longstanding success with leading academic and industrial customers worldwide. Park Systems is a publicly traded cor- poration on the Korea Stock Exchange (KOSDAQ) with corporate head- quarters in Suwon, South Korea, and regional offices in New York and California in the U.S., Germany, France, U.K., China, Japan, Singapore, India, Taiwan, and Mexico. parksystems.com BOOTH 417 TED PELLA INC. For over 50 years, Ted Pella Inc. has served the micros- copy community globally across a broad range of applied sciences and applications. Our product line for use in R&D and FA labs in semiconductor/ optoelectronics was expanded in 2017 with the addition of the former South Bay Technology products. Then expanded again more recently with the acquisi- tion of the former LatticeGear line of scribing and cleaving solutions. Products from both lines will be featured at our booth. tedpella.com BOOTH 731 ULTRA TEC ULTRA TEC introduces an auto-dispense and collect system for up to three polishing fluids, lubricants, or abrasives. ASAP-1 FLUID CONTROL SYSTEM (FCS) allows for precise fluid dosing and removal from the tool/ sample interface during milling and pol- ishing—ensuring that effective machine vision remains possible throughout. Fluids supplied to the surface can be acclimated to the required processing temperature in conjunction with ASAP-1 IN SITU’s Thermal Heat/Cool Stage. This advanced fluid temperature control further assists in mitigating sample stress during processing. ultratecusa.com BOOTH 417
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