November_EDFA_Digital

edfas.org 1 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 4 DEPARTMENTS Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages Douglas Hunt, Daniel Bader, Pascal Limbecker, and Heiko Barth This article introduces a microwave-induced plasma process to remove overmold as well as techniques to handle large packages for EBAC analysis. Author Guidelines Author guidelines and a sample article are available at edfas.org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 14 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2021 | VOLUME 23 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Jan Vardaman 38 EDFAS AWARDS 38 ASM AWARDS 42 ISTFA EXHIBITOR LIST 43 ISTFA EXHIBITOR SHOWCASE 45 BOARD CANDIDATE PROFILES Lee Knauss 46 IN MEMORIAM 47 DIRECTORY OF FA PROVIDERS Rosalinda Ring 50 TRAINING CALENDAR Rosalinda Ring 52 LITERATURE REVIEW Michael R. Bruce 54 PRODUCT NEWS Ted Kolasa 56 EDUCATION NEWS Bhanu P. Sood 57 GUEST COLUMNIST Matthew J. Marinella 60 ADVERTISERS INDEX A Brief Overview of Scanning Transmission Electron Microscopy in a Scanning Electron Microscope Jason Holm Recent advancements in STEM-in-SEM, pros and cons, and applications including 4D STEM-in-SEM are discussed in this article. 18 For the digital edition, log in to edfas.org , click on the “News/Magazines” tab, and select “EDFA Magazine.” A Sample Preparation Workflow for Delayering a 45 nm Node Serial Peripheral Interface Module Yash Patel, Joshua Baur, Jonathan Scholl, Adam R. Waite, Adam Kimura, John Kelley, Richard Ott, and Glen David Via A 45 nm SPI module was delayered using topside CMP methods and wet etching, with additional dry etching techniques. 14 4 18 28 Failure Modes in Microfabricated Ion Trap Devices Matthew G. Blain, Raymond A. Haltli, and Melissa Revelle Three specific examples of failures for packaged trap chips and the resulting technical challenges illustrate how the unique construction requirements and demandingoperating conditions of the trap combine to create unique failure modes. 28 ABOUT THE COVER See page 60 for a description of the contest images collage on the cover.