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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 3 48 flexibility to optimize imaging and analytical conditions in a single experiment means faster 3D characterization of both hard and soft materials within one sample, accel- erating product development research. With increased throughput and detector collection efficiency, multiuser facilities can offer greater accessibility for a broad variety of projects. The easy-to-use Spectra Ultra enables semiconduc- tor researchers to analyze devices and structures quickly and more reliably. With the most powerful commercially released EDX systemand instant switching of accelerating voltages, the Spectra Ultra facilitates the development of new memory and logic devices at advanced technology nodes. For more information, visit thermofisher.com. VK-X3000 3D SURFACE PROFILER With over 20 years of innovation in surface metrology, Keyence has combined several innovative technologies into an all-in-one surface profiler for both 3D shape and texture analysis. The VK-X Series is a non-contact metrol- ogy system designed to provide profile, roughness, and filmthicknessmeasurements on any type of material. The systemcombines three differentmeasurement principles: laser confocal scanning, focus variation, and white light interferometry; enabling nanometer, micrometer, and millimeter measurements on nearly any sample. Unlike typical 3D measurement systems, which can strugglewithmeasurement of certainmaterials (transpar- ent, matte, etc.) or surfaces with curved or steep slopes, the VK-X3000 is able to analyze objects regardless ofmate- rial or shape. Additionally, a 0.1 nm linear scale and NIST traceable calibration ensure that measurements are tied to international standards. To simplify the operation of collecting surface data, the AI-SCAN function was developed to automate the scanning process. Users simply place their sample on the stage and click a single button, the systemwill automati- cally determine the optimum settings to use and begin measuring the surface. Even inexperienced users can quickly and easily obtain accuratemeasurement data and high-resolution images. PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG ALL-IN-ONE STEM OFFERS STRUCTURAL AND CHEMICAL INSIGHT ThermoFisher Scientificunveiled theThermoScientific Spectra Ultra, a next-generation scanning transmission electron microscope (STEM) that offers structural and chemical insight on a wide range of materials at atomic- scale resolution. The new Spectra Ultra provides flexibility to optimize conditions for advanced imaging and analysis in minutes versus hours. To fast-trackmaterials research and improve throughput, users can now rapidly adjust accelerating voltage with high stability. This enables investigation of an extended range of samples, minimizes beam damage and greatly reduces tool optimization overhead. Spectra Ultra includes a new energy-dispersive x-ray (EDX) analysis system, the Thermo Scientific Ultra-X, with the largest detector area available in a commercially released STEM. Combined with the new objective lens design, the EDX detector architecture makes it possible to capture x-rays twice as fast as currently available com- mercial solutions, allowing theanalysis ofmorebeam-sen- sitivematerials and sampleswithpreviously undetectably low concentrations of trace elements. Spectra Ultra builds on the advancements al ready avai lable in the Thermo Scientific Themis and Spectra plat- forms, removing com- plexi ty so users can obtain quality data at high resolutions. These breakthrough technologies expand research possibilities for materials scientists. The minimal electron dose and time needed for EDX enables atomic- level analysis of beam- sensitive specimens. The Thermo Scientific Spectra Ultra Next-Generation STEM.