Aug_EDFA_Digital
edfas.org 45 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 3 Contact Information ASM International 800.336.5152 MemberServiceCenter@asminternational.org asminternational.org EMPC +46.31.708.86.90 empc2021@meetx.se empc2021.org ESD Association Inc. 315.339.6937 www.esda.org/events ICEEP waset.org ICESC +91.8870489968 icescsconf@gmail.com icesc.co.in ICICM +86.28.87777577 icicm@young.ac.cn icicm.net/index.html IECON 604.681.2153 IECON2021@icsevents.com icsevents.com International Microelectronics Assembly & Packaging Society (iMAPS) 919.293.5000 info@imaps.org www.imaps.org/advanced_system-in-package_si.php InterPACK JakubowskiM@asme.org event.asme.org/InterPACK MC2021 +49.3641.31.16.406 mc@conventus.de www.conventus.de NIST 301.975.2000 nist.gov/news-events/upcoming-events SEMICON SEA +65.6339.6361 semiconsea.org SEMICON Taiwan +65.6339.6361 semicontaiwan.org Semitracks Inc. 505.858.0454 info@semitracks.com www.semitracks.com SMTA/CALCE 952.920.7682 smta.org/mpage/counterfeit SMTA 952.920.7682 smta@smta.org smta.org SPIE 888.504.8171 customerservice@spie.org spie.org EVENT DATE LOCATION EOS/ESD Symposium and Exhibits 9/26-10/1 Tucson, AZ Contact: ESD Association Inc. September 2021 (cont'd) Check organizers' websites below for the most up-to-date information, in light of COVID-19. EVENT DATE LOCATION Annual Conference of the IEEE Industrial Electronics Society (IECON) 10/10-23 Toronto, Canada Contact: IECON International Symposium on Microelectronics 10/11-14 San Diego, CA Contact: iMAPS Practical Interpretation of Microstructures 10/18-20 Novelty, OH Metallurgy for the Non-metallurgist 10/25-28 Novelty, OH Contact: ASM International October 2021 EVENT DATE LOCATION Mass Metrology Seminar 10/18-29 Gaithersburg, VA Contact: NIST International Conference on Integrated Circuits and Microsystems (ICICM) 10/22-24 Nanjing, China Contact: ICICM International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 10/26-28 Virtual Event Contact: InterPACK International Symposium on Testing and Failure Analysis (ISTFA) 10/31- 11/4 Phoenix, AZ Contact: ASM International October 2021 (cont'd)
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RkJQdWJsaXNoZXIy MTE2MjM2Nw==