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edfas.org 23 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 3 NOTEWORTHY NEWS MICROSCOPY &MICROANALYSIS MEETING 2021 TheMicroscopy &Microanalysis (M&M) 2021meeting is scheduled to be held virtually August 1-5. The scientific program features the latest advances in biological, physical, and analytical sciences as well as techniques and instrumentation. M&M is sponsored by the Microscopy Society of America, the Microanalysis Society, and the Microscopical Society of Canada. For more information, visit microscopy.org/ MandM/2021 and watch for any updates to the meeting plan. IPFA 2021 The 28th International Symposium on the Physical and Failure Analysis of IntegratedCircuits (IPFA 2021) will be held virtually inSeptember. IPFAwill continue to focus on the fundamental understanding of the electrical and physical charac- terization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device/circuit/module failure that serves as critical input for future design for reliability. Formore information and updates on the dates and times of the virtual sessions, visit the IPFA website at ipfa-ieee.org . ESREF 2021 The 32nd European Symposiumon Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2021) will be held as a virtual event, October 4-8. The conference will be hosted by the IMS laboratory, University of Bordeaux in collaboration with LAAS_CNRS, University of Toulouse. This international symposiumcontinues to focus on recent developments and future directions in failure analysis, quality and reliability of materials, and devices and circuits for micro, nano, and optoelectronics. It provides the leading European forumfor developing all aspects of reliabilityman- agement and innovative analysis techniques for present and emerging semiconductor applications. For more information, visit esref2021.sciencesconf.org. ITC 2021 The International Test Conference (ITC) will be held October 10-15 as a virtual event. ITC is the world’s premier conference dedicated to the electronic test of devices, boards, and systems covering the complete cycle from design verification, test, diagnosis, failure analysis, and back to process and design improvement. At ITC, test and design professionals will confront the challenges the industry faces and learn how these issues are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. ITC, the cornerstone of TestWeek events, offers awide variety of technical activities targeted at test and design theoreti- cians and practitioners. The conference includes paper sessions (along with new short papers), tutorials, panel sessions, case studies, and online exhibition “booths” and chat rooms for virtual networking. The Automotive Test Workshop, immediately following the conference, will also be in online format. ITC is sponsored by the IEEE. For more information, visit itctestweek.org .