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edfas.org 43 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 2 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Howard Hughes Research Labs LLC jmj4papa@yahoo.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED BEAM ENGINEERING RESEARCH INC. (ABER LABS) 990 Richard Ave., Suite #112 Santa Clara, CA 95050 408.899.2590 service@aber-labs.com www.aber-labs.com Services Offered: IC decapsulation, FIB circuit edit, and front-side FIB. Tools and Techniques: Jet etching, Sesame 1000 laser decapping tool, FEI Vectra-IET FIB system with Knights- Camelot software CAD navigation, circuit design analysis, circuit modification, circuit design debugging, circuit design verification, circuit isolation, and selective probe pad deposition for mechanical probing. ADVANCED CIRCUIT ENGINEERS LLC 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com www.advancedcircuitengineers.com Services Offered: Frontside and backside FIB circuit edit, STEM/TEM analysis and imaging, dual-beam (FIB-SEM) sample preparation and imaging. Tools and Techniques: Dual-beam (FIB-SEM), high-reso- lution SEM, FIB-SEM cross section, EDS, S/TEM imaging, EELS and EDX quantification and mapping, tomography and holography, and frontside and backside circuit edit. CHIP TARGETS INC. 1400 S Sherman St., #212 Richardson, TX 75081 972.470.9290 sales@chiptargets.com chiptargets.com/contact/ Services Offered: Electronic/electrical failure analysis. Tools and Techniques: 2D and 3D x-ray analysis (Dage x-ray), surface analysis XPS/ESCA (Thermo Fisher Nexsa), focus ion beam – dual beam FIB/SEM and single beam FIB with layout navigation (FEI Strata 400S and FEI V600), TEM, OBIRCH/TIVA/photo emissions/thermal mapping/ IR hot spot analysis (Hamamatsu PHEMOS1000 and QFI QuantumScope), cross section and polish using broad beam ion mill machines (Hitachi IM4000 and Leica RES101), SAM (SAMSonix ECHOVS), decapsulations using laser, acid, andplasma techniques (NiseneCopper Protect, Jiaco MIP), optical, Keyence, Nomarski inspections, field emission SEM and energy dispersive spectrometry EDX, rework, IC packaging and repackaging, bond pull/shear/ die shear, real-time x-ray analysis, automated unbiased and biased curve tracer analysis (UTI), and time domain reflectometry analysis. FAILURE ANALYSIS INSTRUMENTS 2381 Zanker Rd., Suite 100 San Jose, CA 95131 510.851.5555 info@fainstruments.com www.fainstruments.com Services Offered: Full contract failure analysis laboratory services fromsample preparation (thinning and endpoint- ing: board, package, and die), through microscopy to world-renowned analytical skills, and consulting. Tools and Techniques: Alpha Innotech FA1000 Emission Microscope (CCDCamera/InGaAs Camera), coherent laser illuminator, UV/thermal controller, stimulus induced fault testing, fluorescence micro-thermal imaging, Moiré thermal imaging, liquid crystal analysis, parametric ana- lyzer, and upgrade cameras. FAILURE ANALYSIS SERVICE TECHNOLOGY INC. 2208 Melville Rd. Prescott, AZ 86301 800.657.5664 george@fod.com www.fod.com Services Offered: Aviation mishap investigation, foreign object damage, fire forensics, materials and processing problems, aircraft corrosion, paint chipping, and mate- rial defects. Tools andTechniques: Scanning electronmicroscope and energy dispersive spectroscopy. IEC ELECTRONICS ANALYSIS AND TESTING LABORATORY 328 Silver Hill Rd. Newark, NY 14513 315.331.7742