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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 2 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/PrimeNano nicholas@primenanoinc.com Scott D. Henry Publisher Mary Anne Fleming Manager, Technical Journals Kelly Sukol Production Supervisor Joanne Miller Managing Editor Victoria Burt Contributing Editor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Szu Huat Goh GlobalFoundries Singapore Ted Kolasa Northrop Grumman Innovation Systems Rosalinda M. Ring Howard Hughes Research Labs LLC Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Paiboon Tangyunyong Sandia National Labs Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub- lished quarterly by ASM International ® , 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright©2021by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $160 U.S. per year. Authorization tophotocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registeredwith theCopyright ClearanceCenter (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly toCCC, 222 RosewoodDrive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. I n this column, I would like to share some details about ASM Connect, a social platform for members of ASM and EDFAS that was launched last year. Connect is a community building tool and is great for keeping the members engaged and “connected” throughout the year. The site can be used for the following: 1. Networking—Find current ASM/EDFAS members and communicate with them directly through the Member Directory. You can use this tool to find members based on affiliation, company, location, job title, and interest, just to name a few. 2. Find Experts—Find self-identified experts and communicate with them through the Expert Directory. 3. FA Technology Roadmap—The Roadmap Committee has posted its initial gap analysis and white papers on Connect and is soliciting your input. 4. Connect with the Community—Ask your peers for assistance. Post a question or discussion in the community (ASM Connect currently has over 1.2K discussions). As an EDFAS member you can participate in these discussions. EDFAS is just starting to build its discussion forum. 5. Library—Share resources in the library; links to interesting stories, videos, TED talks, or whatever may be of interest to the community. 6. Access to the Volunteer Center—See opportunities to participate within the society. 7. Join or create new communities of interest. MAY 2021 | VOLUME 23 | ISSUE 2 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL JOIN THE ONLINE COMMUNITY THROUGH CONNECT Nicholas Antoniou, PrimeNano Inc. nicholas@primenanoinc.com edfas.org Antoniou As a member of the FA Technology Roadmap Committee, I encourage you to engage with this effort on Connect. This is the only place where you can see and influence the shape of the Roadmap. We need to hear from our members on what challenges they face, improvements they want to see, and new technologies to evaluate. The Roadmap can be accessed directly at connect.asminternational.org/edfasistfafatechnologyroadmap/home. Connect is your platform and the more we engage in it the greater the value it will bring to us all. Visit ASM Connect and join in on the conversation: https://connect.asminternational.org/home.
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