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edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 2 18 Fig. 6 Slices of a small region of the the second lowest layer. (a) Virtual slice of the laminography dataset. (b) The same regionmeasuredviamechanical delayeringand scanning electron microscopy. Figure adapted from Holler et al. [28] (a) (b) the entire connectome in 3D. By imaging the entire volume at once in a nondestructive manner, delayering artifacts, as occurring in destructive layer-based approaches, are entirely avoided. Theunique combinationof high resolutionandvolume allows PyXL to be applied to failure analysis, electrostatic damage investigation, as well as reverse engineering. The measurement rates that are currently achievable at the synchrotron light source (Swiss Light Source, SLS) are in the range of 5000 resolution elements per second. In the case of the high-resolution laminography measurement shown before (18.9 nm resolution in a 4 µm thickness, 40 µm diameter volume), the measurement time was approximately two entire days. The coherent fraction of the total flux at the cSAXS beamline at the SLS, where the measurement were performed, is only in the few percent range, meaning most of the x-ray radiation generated cannot be used in the measurement, which is relying on coherence, and is thus scrapped by coherence filtering. Similar tomany third-generation synchrotron sources around the globe PSI will upgrade the storage ring of the SLS toward a fourth-generation light source. [30] The expected increase in coherent flux is about a factor 40. Beyond this, there are further possible improvements in the beamline layout mentioned in Holler et al., [28] which would potentially further increase the flux to a total of up to four orders of magnitude. With concomitant improve- ments in instrumentation and detectors, ptychographic 3D imaging can fully benefit from this increase in coher- ent flux and thereby a drastic decrease in measurement time and/or improvement in resolution is expected in the years to come. GETTING ACCESS PSI is the largest research institute for natural and engi- neering sciences in Switzerland, conducting cutting-edge research in threemain fields:matter andmaterials, energy and the environment, and human health. PSI develops, builds, and operates complex large research facilities. Every year,more than2500 scientists fromSwitzerlandand around the world come to PSI to use the unique facilities. PSI provides access to their research facilities via a User Service to researchers from universities, other research centers, and industry. Apply for beamtime: https://www. psi.ch/en/sls/csaxs/application-for-beamtime. REFERENCES 1. G. Servanton, et al.: “Advanced TEM Characterization for the Devel- opment of 28-14nm Nodes Based on Fully-depleted Silicon-on- Insulator Technology,” 18th Microscopy of Semiconducting Materials Conference, T. Walther and J.L. Hutchison, Editors, 2013. 2. L.M. Gignac, et al.: “High Energy BSE/SE/STEM Imaging of 8 umThick Semiconductor Interconnects,” Microscopy andMicroanalysis, 2014, 20 (S3) p. 8-9. 3. N.G. Orji, et al.: “Metrology for theNext Generation of Semiconductor Devices,” Nature Electronics, 1 (12), 2018, p. 662-662. 4. P. Thibault, et al.: “High-resolution Scanning X-ray Diffraction Microscopy,” Science, 2008, 321 (5887), p. 379-382. 5. F. Pfeiffer: “X-ray Ptychography,” Nature Photonics, 12 (1), 2018, p. 9-17. 6. J.M. Rodenburg, et al.: “Hard-X-Ray Lensless Imaging of Extended Objects,” Physical Review Letters, 98 (3), 2007, p. 4. 7. B. Enders and P. Thibault: “A Computational Framework for Ptycho- graphic Reconstructions,” Proceedings: Mathematical, Physical, and Engineering Sciences, 472 (2196), 2016, p. 20160640-20160640. 8. O. Mandula, et al.: “PyNX.Ptycho: A Computing Library for X-ray Coherent Diffraction Imaging of Nanostructures,” Journal of Applied Crystallography, 49 (5), 2016, p. 1842-1848. 9. K. Wakonig, et al.: “PtychoShelves, A Versatile High-level Framework for High-performance Analysis of Ptychographic Data,” Journal of Applied Crystallography, 53 (2), 2020, p. 574-586. 10. M. Guizar-Sicairos, et al.: “High-throughput Ptychography Using Eiger: Scanning X-ray Nano-imaging of Extended Regions,” Optics Express, 22 (12), 2014, p. 14859-14870. 11. B. Abbey, et al.: “Quantitative Coherent Diffractive Imaging of an Integrated Circuit at a Spatial Resolution of 20 nm,” Applied Physics Letters, 93 (21), 2008, p. 214101. 12. A. Schropp, et al.: “Non-destructive and Quantitative Imaging of a Nano-structured Microchip by Ptychographic Hard X-ray Scanning Microscopy,” Journal of Microscopy, 241 (1), 2011, p. 9-12. 13. R. Dinapoli, et al.: “EIGER: Next Generation Single photon Counting Detector for X-ray Applications,” Nuclear Instruments & Methods in STATE-OF-THE=ART HIGH-RESOLUTION 3D X-RAY MICROSCOPY (continued from page 16)