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edfas.org 1 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 2 DEPARTMENTS State-of-the-Art High-Resolution 3D X-ray Microscopy for Imaging of Integrated Circuits Mirko Holler, Manuel Guizar-Sicairos, and Jörg Raabe 3Dx-rayptychography canbridge the imaginggapbetween conventional x-ray microscopy and electron microscopy for failure analysis, electrostatic damage investigation, as well as reverse engineering. Author Guidelines Author guidelines and a sample article are available at edfas. org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 13 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2021 | VOLUME 23 | ISSUE 2 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Nicholas Antoniou 38 MASTER FA TECHNIQUE Travis Mitchell, Brian Popielarski, and Frieder B aumann 40 2021 PHOTO CONTEST 41 2021 VIDEO CONTEST 42 EDUCATION NEWS Felix Beaudoin 43 DIRECTORY OF FA PROVIDERS Ros alinda Ring 45 TRAINING CALENDAR Rosalinda Ring 47 LITERATURE REVIEW Michael R. Bruc e 49 PRODUCT NEWS Ted Kolasa 51 GUEST COLUMNIST Ted Kolasa 52 ADVERTISERS INDEX TEM Study of Oxygen Partial Pressure Effect on Early LSM-YSZ Surface Interactions in Solid Oxide Fuel Cells H.J. Wang, M. Chen, Y.L. Liu, L. Theil Kuhn, and J.R. Bowen Lanthanum strontium manganite and yttrium stabilized zirconia (LSM-YSZ) reaction mechanisms in SOFCs vary substantially with respect to the oxygen partial pressure at the cathode/electrolyte interface. 22 For the digital edition, log in to edfas.org , click on the “News/Magazines” tab, and select “EDFA Magazine.” Security Assessment of IC Packaging Against Optical Attacks Chengjie Xi, Aslam A. Khan, M. Tanjidur Rahman, and Navid Asadizanjani This article looks at IC packaging’s interconnection tech- nology, a study of optical attacks, threat models, and countermeasures. 13 4 22 33 EDFAS User Groups Series 2021 Highlights Tejinder Gandhi, Anita Madan, and Ted Kolasa A recap of the virtual EDFAS User Groups Series include s summaries of the four User Groups held in January 2021 . 33 ABOUT THE COVER Germaniumoxide on bond wire. Photo by Jason Silva, Maxim Integrated, BlackandWhite Images, 2020EDFASPhotoContest.