May_EDFA_Digital

A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2021 | VOLUME 23 | ISSUE 2 ELECTRONIC DEVICE FAILURE ANALYSIS edfas.org SECURITY ASSESSMENT OF IC PACKAGING OXYGEN PARTIAL PRESSURE EFFECT ON EARLY LSM-YSZ SURFACE INTERACTION S EDFAS USER GROUPS SERIES 2021 HIGHLIGHTS STATE-OF-THE-ART HIGH-RESOLUTION 3D X-RAY MICROSCOPY 4 22 13 33