SPECIAL SESSIONS & EVENTS Monday, November 17 | 7:45 – 10:00 a.m. Opening Session and EDFAS General Membership Meeting Monday, November 17 | 6:30 – 9:30 p.m. Social Networking Event Sponsored by Thermo Fisher Scientific Tuesday, November 18 | 4:30 – 6:00 p.m. Welcome Reception with Exhibitors Wednesday, November 19 | 12:00 – 1:00 p.m. Women in Electronics Failure Analysis (WEFA) Wednesday, November 19 | 1:30 – 3:00 p.m. Panel Discussion: “Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging” Wednesday, November 19 | 3:00 – 4:00 p.m. Expo Dessert Reception, Poster Session, and Video Contest TOOLS OF THE TRADE TOUR Tuesday, November 18 ISTFA attendees will have the chance to see the latest equipment and tools in action and obtain useful information in a guided tour. Participating companies include: Allied High Tech Products, DIGIT CONCEPT, JIACO Instruments, NanoScience Instruments, Quartz Imaging, SELA USA, Siemens, Thermo Fisher Scientific, ULTRA TEC, and ZEISS. Pre-registration is required. Limit of 125 attendees. SPECIAL CONTESTS See the winners of the EDFAS Video Contest, featuring three-minute videos on failure analysis, as well as the best of the EDFAS Photo Contest, with categories in optical microscopy, SEM/TEM/x-ray/UV micrographs, and photon emissions. First Place Winner in False Color images, 2024 EDFAS Photo Contest. Courtesy of Wentao Qin et al., Microchip Technology Inc. TECHNICAL PROGRAM TOPICS » AI Applications for Failure Analysis » Boards and System Level FA CHIPS Act Update » Device Analysis – Case Studies » Die Level Fault Isolation » Emerging FA Techniques and Concepts » FA Process: Fault Isolation, Mechanisms, and Solutions » FIB Circuit Analysis and Edit » FIB Sample Preparation » Hardware Security and Counterfeiting » Microscopy Analysis and Materials Characterization » Nanoprobing and Electrical Characterization » Package Level Fault Isolation » Power Devices (Si, SiC, GaN) » Product Yield, Test, and Diagnosis » Sample Preparation and Device Deprocessing » Scanning Probe Analysis » System-in-Package and 3D Devices ISTFA.ORG 3D-Micromac AG Allied High Tech Products, Inc. Angstrom Scientific, Inc. Bruker Corporation BSET EQ Checkpoint Technologies Comet Industrial X-ray Modules Comet Yxlon Contech Solutions Inc. Convalent Metrology DC – Digit Concept Denton Vacuum EAG Laboratories Ebatco Eurofins | MASER Excillum Fischione Instruments Hamamatsu Corporation Herzan LLC HILEVEL Technology Hi-Rel Laboratories Hitachi High-Tech America, Inc. Hitachi Power Solutions Co., Ltd. ibss Group Imina Technologies SA InfraTec infrared LLC Integra Technologies Integrated Service Technology Inc. (iST) Intlvac Thin Film JEOL USA JIACO Instruments Keysight Technologies Kleindiek Inc. Laser Thermal Analysis Materials Analysis Technology Inc. Mesoscope Technology Co. Ltd. Microsanj MSS USA Corp. Nanoscience Instruments NenoVision Neocera Magma LLC Nippon Scientific Co., Ltd. Nisene Technology Group, Inc. Nordson Test & Inspection Oxford Instruments Park Systems Inc. Photothermal Spectroscopy Corp Physical Electronics PVA TePla OKOS Quantum Design Quantum Focus Instruments Corporation Quartz Imaging QZabre Raith America, Inc. RKD Engineering RKD Systems Robson Technologies, Inc. (RTI) Seiwa Optical of America SELA USA Inc. SEMICAPS Siemens Sigray, Inc. SmarAct Inc. Ted Pella, Inc. TeraView LTD EXHIBITOR LIST Exhibitor list current as of September 23. TUESDAY, NOVEMBER 18 9:30 A.M. – 6:00 P.M. WEDNESDAY, NOVEMBER 19 9:00 A.M. – 4:00 P.M. EXHIBITION HOURS Pasadena Convention Center TESCAN Thermo Fisher Scientific Tiptek, LLC Trion Technology ULTRA TEC Varioscale Inc. Waygate Technologies XEI Scientific ZEISS Microscopy Zurich Instruments USA, Inc.
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