ADVANCED MATERIALS & PROCESSES | NOVEMBER/DECEMBER 2024 7 resulted in the formation of sites on the material that could bind to gold ions. After the gold ions are absorbed into the graphene, the chitosan converts them into their solid gold state, allowing for easy collection—a process the research team describes as highly efficient. The team tested their sponge using real e-waste provided by a recycling company. Measurement prior to treatment showed gold concentrations of 3 ppm. The newly developed sponge was able to extract approximately 17g/g of Au3+ ions and a little more than 6 g/g of Au+. Such amounts, the team claims, are approximately 10 times that of any other known extraction process. www.manchester.edu, www.nus.edu.sg, www.english.gdut.edu.cn. LONG SPIN RELAXATION PROVIDES SPINTRONIC INSIGHTS At Osaka Metropolitan University in Japan, a research group is studying spin currents for implementation in next-generation technology such as memory devices. To investigate the characteristics of spin currents, Professor Katsuichi Kanemoto’s group designed a multilayer device consisting of a ferro-magnetic layer and an organic semiconductor material. By adopting a doped conducting polymer with a long spin relaxation time, the team succeeded in observing the effects of spin transport and spin current generation from the non-magnetic, organic semiconductor side. The long spin relaxation times not only equate to more efficiency in spintronics but also enable direct observation of phenomena due to spin current generation in the organic layer side. Moreover, the researchers were able to find that—contrary to a widely accepted theory—the width of the ferro-magnetic resonance measurements for the layer of the spin current supplier slightly narrowed in the device system using the organic semiconductor with a long spin relaxation time. www.omu.ac.jp/en. Measurements of spin currents in the hybrid interface of a device with a ferro-magnetic (Py) layer and an organic semiconductor (PANI) layer. Courtesy of Osaka Metropolitan University. One Part Supreme 10HT for STRUCTURAL TOUGHENED EPOXY BONDING Hackensack, NJ 07601 USA • +1.201.343.8983 • main masterbond.com www.masterbond.com HIGH BOND STRENGTH Lap shear strength | 3,600-3,800 psi Tensile modulus | 450,000-500,000 psi NASA LOW OUTGASSING Per ASTM E595 standards SERVICE TEMPERATURE RANGE From 4K to +400°F
RkJQdWJsaXNoZXIy MTYyMzk3NQ==