OCTOBER 28–NOVEMBER 1, 2024 | HILTON SAN DIEGO BAYFRONT 50TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS Riding the wave of artificial intelligence 2024 Join the celebration of a remarkable milestone: the 50th anniversary of ISTFA! Commemorate this golden occasion by attending this year’s pinnacle event for the microelectronics failure analysis community in San Diego. The theme—Riding the Wave of Artificial Intelligence— will serve as a focal point in user group meetings, technical presentations, and keynotes. The conference also includes the highly popular EDFAS video and photo contests. ISTFA once again o ers the opportunity to take an immersive half- or full-day educational course. This year’s tutorial program extends the learning process to a wider selection of topics. The technical sessions feature over 100 presentations of original unpublished work in areas such as sample preparation and device deprocessing, fault isolation, AI applications for FA, scanning probe analysis, and emerging FA techniques and concepts. And the Expo features key companies showcasing the best technologies and products in the industry. sponsored by: ORGANIZED BY: TUESDAY, OCTOBER 29 Dr. Marla Dowell, Director of the CHIPS Metrology Program and NIST Boulder Laboratory, will talk on “The CHIPS Metrology Program,” which emphasizes measurements that are accurate, precise, and fitfor-purpose for the production of microelectronic materials, devices, circuits, and systems. Dowell will give insights into CHIPS funded metrology projects and their contribution to failure analysis and reliability. WEDNESDAY, OCTOBER 30 Dr. James Chambers, Vice President, Silicon Engineering and Sourcing at NVIDIA, will explore the implications the Generative AI Era is having on quality and reliability requirements, the types of latent defects that cause artificial intelligence (AI) workloads to fail, future technology developments to support AI and their impact on failure analysis techniques and methodologies, and the application of AI to enhance the e iciency of failure analysis. Dowell Chambers EDUCATION WORKSHOPS • FAILURE ANALYSIS OF ELECTRONIC DEVICES INSTRUCTOR: DR. SIMARDNORMANDIN • BEAM-BASED DEFECT LOCALIZATION INSTRUCTOR: DR. ED COLE, JR., FASM • MATERIALS SCIENCE IN PHYSICAL FAILURE ANALYSES FOR ROOT-CAUSE FINDING INSTRUCTOR: WENTAO QIN FOR DATES, TIMES, AND FULL COURSE DESCRIPTIONS, VISIT ISTFA.ORG. TUTORIALS AN EXPANDED TUTORIAL PROGRAM ADDRESSES 25 TOPICS, INCLUDING SEVERAL NEW ONES. KEYNOTE SESSIONS
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