AMP 02 March 2024

HIGHLIGHTS ADVANCED MATERIALS & PROCESSES | MARCH 2024 45 The boards of the Electronic Device Failure Analysis Society (EDFAS), Failure Analysis Society (FAS), Heat Treating Society (HTS), International Metallographic Society (IMS), and Thermal Spray Society (TSS) have appointed chairs to each of their committees for the 20232024 term. Chairs for ASM Society and General Committees and Councils appeared in the January/February 2024 issue of ASM News. The purpose of each committee is stated on its affiliate society website under the Membership and Networking tab. Electronic Device Failure Analysis Society (EDFAS) Felix Beaudoin, FASM, PMTS yield engineer, GlobalFoundries, serves as president of EDFAS. Renee Parente, technology & product engineering operations director, AMD, serves as vice president/finance officer of EDFAS. James Demarest, FASM, senior engineer, IBM, serves as immediate past president of EDFAS and chair of the EDFAS Awards & Nominations Committee. Nicholas Antoniou, vice president of product management, PrimeNano Inc., continues to serve as chair of the Electronic Device Failure Analysis Editorial Board. Tom Schamp, principal consulting scientist, continues to serve as chair of the EDFAS Membership Subcommittee. Bhanu Sood, deputy center chief technologist, office of the director, NASA Goddard Space Flight Center, continues to serve as chair of the EDFAS Education Subcommittee. Yan Li, principal engineer, Samsung Electronics Inc., was named chair of the EDFAS Event Committee. Keith Serrels, principal failure analysis engineer, NXP Semiconductors, continues to serve as chair of the EDFAS FA Technology Roadmap Committee. Failure Analysis Society (FAS) Brett Miller, FASM, technical director, IMR Test Labs - Louisville, serves as president of FAS. Margaret Flury, principal materials engineer, Medtronic, serves as vice president of FAS. Andrew (Tony) Havics, director, pH2 LLC, serves as immediate past president and chair of the FAS Awards & Nominations Committee. Jake Auliff, senior manager – materials engineering, Danfoss Power Solutions, continues to serve as chair of the FAS Programming Committee. AFFILIATE COMMITTEE CHAIRS AFFILIATE SOCIETIES NAME COMMITTEE CHAIRS FOR 2023-2024 TERM Demarest Schamp Beaudoin Parente Antoniou Sood Havics Li Serrels Miller Flury Auliff

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