14 ADVANCED MATERIALS & PROCESSES | MAY/JUNE 2023 ADVANCING DIFFUSION BONDED COMPACT HEAT EXCHANGERS FOR HIGH TEMPERATURE APPLICATIONS Mohamed Elbakhshwan, Lukas Desorcy, Ian Jentz, and Mark Anderson, University of Wisconsin–Madison Fei Gao and Todd Allen,* University of Michigan, Ann Arbor Mark Messner, Argonne National Laboratory, Lemont, Illinois Mike McMurtrey, Idaho National Laboratory, Idaho Falls Jim Stubbins, University of Illinois Urbana-Champaign John Shingledecker, FASM,* Electric Power Research Institute (EPRI), Charlotte, North Carolina Billy Nollet, Fort Lewis College, Durango, Colorado Bob Keating and Suzanne McKillup, MPR Associates Inc. Enhancement of the di usion bonding process for the development of compact heat exchangers provides an energy e cient solution for hightemperature applications in advanced nuclear reactors and other technologies. *Member of ASM International Image courtesy of Vacuum Process Engineering Inc. HEAT EXCHANGERS
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