4 The global chip shortage has adversely impacted the auto industry for the past three years. J.P. Morgan predicts a gradual recovery starting at the end of this year and resulting in a 7% increase in car production worldwide in 2023. In the U.S., the CHIPS and Science Act of 2022 is aimed at helping the country rebuild supply chains in the semiconductor industry by lowering the cost of goods and creating high paying chip manufacturing jobs. My home state of Ohio is a key beneficiary with Intel building two chip factories just outside of Columbus. But workforce development will be critical to making those fabs productive in order to meet the J.P. Morgan forecast. ASM’s Electronic Device Failure Analysis Society (EDFAS) is doing more than its part to assist the semiconductor industry as it works through the chip shortage and other hurdles. EDFAS has embarked on the herculean task of developing a Failure Analysis Technology Roadmap. The purpose is twofold: to document current and future FA challenges; and to leverage input from equipment providers and academic labs in devising solutions to those impediments. I attended this year’s International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena, California, where Lesly Endrinal of Qualcomm, one of the EDFAS Roadmap division chairs, stated in a session, “Technologies are getting more difficult to debug.” She’s referring to several challenges converging at once: Electronic devices are getting smaller and smaller; tools that previously were a mainstay are ineffective or even unusable in the new environments; and the globalization of the supply chain has led to new problems such as malicious implants and counterfeiting. On top of this, there is a major architecture evolution occurring in transistors. As ISTFA keynote speaker Emmanuel Crabbé of IBM explained, in 2011, FinFETs replaced planar transistors. And now stacked nanosheets are becoming the standout technology due to their higher drive current per unit area and design flexibility. All of these changes mean that cross-discipline discussions need to occur more often and the FA engineers need to work with device designers upstream. It also means that more creative thinking is needed by the industry as a whole. An example of this kind of creative mind is Hanchen Huang, FASM, who coinvented MesoGlue, which allows a unique way to join a chip to a substrate without heat. Every day, innovators like Huang solve materials challenges in many industries. In this issue, we feature seven such entrepreneurs whose unique career paths led them to become an inventor or create a startup. I asked them each to share how they got started and what advice they have for STEM entrepreneurs of the future. Maybe some of their comments will resonate with you, or perhaps you have advice of your own. I invite you to share your thoughts with me. Whether your work involves materials on a macro or submicron scale, join your community in mapping out the road ahead. joanne.miller@asminternational.org A D V A N C E D M A T E R I A L S & P R O C E S S E S | N O V E M B E R / D E C E M B E R 2 0 2 2 ASM International 9639 Kinsman Road, Materials Park, OH 44073 Tel: 440.338.5151 • Fax: 440.338.4634 Joanne Miller, Editor joanne.miller@asminternational.org Victoria Burt, Managing Editor vicki.burt@asminternational.org Frances Richards and Corinne Richards Contributing Editors Jan Nejedlik, Layout and Design Allison Freeman, Production Manager allie.freeman@asminternational.org Press Release Editor magazines@asminternational.org EDITORIAL COMMITTEE Adam Farrow, Chair, Los Alamos National Lab John Shingledecker, Vice Chair, EPRI Somuri Prasad, Past Chair, Sandia National Lab Beth Armstrong, Oak Ridge National Lab Margaret Flury, Medtronic Surojit Gupta, University of North Dakota Nia Harrison, Ford Motor Company Michael Hoerner, KnightHawk Engineering Hideyuki Kanematsu, Suzuka National College of Technology Ibrahim Karaman, Texas A&M University Ricardo Komai, Tesla Bhargavi Mummareddy, Dimensional Energy Scott Olig, U.S. Naval Research Lab Christian Paglia, SUPSI Institute of Materials and Construction Amit Pandey, Lockheed Martin Space Satyam Sahay, John Deere Technology Center India Kumar Sridharan, University of Wisconsin Jean-Paul Vega, Siemens Energy Vasisht Venkatesh, Pratt & Whitney ASMBOARDOF TRUSTEES David B. Williams, President and Chair Pradeep Goyal, Senior Vice President Navin Manjooran, Vice President Judith A. Todd, Immediate Past President John C. Kuli, Treasurer Burak Akyuz Amber Black Ann Bolcavage Pierpaolo Carlone Elizabeth Ho man Toni Marechaux André McDonald U. Kamachi Mudali James E. Saal Sandra W. Robert, Executive Director STUDENT BOARDMEMBERS Jaime Berez, Ashlie Hamilton, Nicole Hudak Individual readers of AdvancedMaterials & Processes may, without charge, make single copies of pages therefrom for personal or archival use, or may freelymake such copies in such numbers as are deemed useful for educational or research purposes and are not for sale or resale. Permission is granted to cite or quote fromarticles herein, provided customary acknowledgment of the authors and source is made. The acceptance and publication of manuscripts in Advanced Materials & Processes does not imply that the reviewers, editors, or publisher accept, approve, or endorse the data, opinions, and conclusions of the authors. MAPPING OUT SOLUTIONS Federal and state o icials at Ohio’s new chip fab site. Courtesy of Intel.
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