ISTFAEVENT.ORG exhibitor list 3D-Micromac America LLC Allied High Tech Products attocube systems Inc. Barnett Technical Services Bruker Corporation BSET EQ Carl Zeiss Microscopy, LLC Checkpoint Technologies Contech Solutions Inc. Control Laser Corp. DC – Digit Concept Denton Vacuum ElectronMicroscopy Sciences Eurofins | MASER Gatan EDAX Hamamatsu Corporation HDI Solutions - Hitachi Herzan LLC Hexagon Hi-Rel Laboratories ibss Group Imina Technologies SA/ AngstromScientific InfraTec GmbH Integra Technologies Intlvac Thin Film JEOL USA JIACO Instruments KEYENCE Corporation of America Kleindiek Inc. Leica Microsystems Materials Analysis Technology Mesoscope Technology Co. Ltd. Nanoscience Instruments Nisene Technology Group, Inc. Nordson Test & Inspection Oxford Instruments Park Systems Inc. Protochips PVA TePla OKOS Quartz Imaging Raith America, Inc. RKD Engineering Corp., Inc. RKD Systems Robson Technologies Inc. Sage Analytical Lab SELA USA Inc. SEMICAPS Siemens Sigray, Inc. SmarAct Inc. Ted Pella, Inc. TeraView LTD TESCAN Thermo Fisher Scientific Tiptek, LLC Trion Technology ULTRA TEC Varioscale Inc. XEI Scientific Zurich Instruments USA, Inc. Exhibitor list current as of August 17. EXHIBIT HOURS TUESDAY, NOVEMBER | : A.M. – : P.M. WEDNESDAY, NOVEMBER | : A.M. – : P.M. Emerging FA Techniques System-in-Package and 3D Devices AI Applications for Failure Analysis Die Level Fault Isolation Package Level Fault Isolation Nanoprobing and Electrical Characterization Scanning Probe Analysis Sample Preparation and Device Deprocessing FIB Sample Preparation FIB Circuit Analysis and Edit Microscopy and Materials Characterization Packaging and Assembly Board and System Level Failure Analysis Case Studies: Device Analysis Case Studies: FA Process Hardware Attacks, Security, and Reverse Engineering Detecting and Preventing Counterfeit Microelectronics Product Yield, Test, and Diagnosis TUESDAY, NOVEMBER FA Roadmap WEDNESDAY, NOVEMBER Standardized and AI Enhanced FA Workflows WEDNESDAY, NOVEMBER Women in Electronics Failure Analysis TOOLS OF THE TRADE TOUR MONDAY, OCTOBER ISTFA attendees will have the chance to see the latest equipment and tools in action and obtain useful information in a guided tour. Participating companies include: Allied High Tech Products, JIACO Instruments, RKD Systems, SELA USA Inc., SIEMENS, and ULTRA TEC. Pre-registration is required. Limit of 125 attendees. Tools Tour will practice any/all safety protocols set forth by the Pasadena Convention Center. KEYNOTE SESSION TECHNICAL PROGRAM TOPICS SPECIAL SESSIONs Crabbé SPECIAL CONTESTS See the winners of the EDFAS Video Contest, featuring three-minute videos on failure analysis, as well as the best of the EDFAS Photo Contest, with categories in optical microscopy, SEM/TEM/x-ray/UV micrographs, and photon emissions. First Place Winner in Color images, 2019 EDFAS Photo Contest. Courtesy of Kevin Awai, Raytheon. TUESDAY, NOVEMBER Dr. Emmanuel Crabbé, IBM Fellow, will talk on “CMOS Scaling: Where to Next?” Beyond nanosheets—first demonstrated by IBM in 2017— the vertical-transport nanosheet device and transistor stacking are promising new architectures under development, which overcome scaling issues.
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