9 2022 CATALOG • ISSUE 1 ISTFATM 2021 Proceedings from the 47th International Symposium for Testing and Failure Analysis 2021 • 461 pages Print: $185 / ASM or EDFAS Member: $140 ISBN: 978-1-62708-419-2 Product Code: 02223G ISTFATM 2020 Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis 2020 • 396 pages Print: $185 / ASM or EDFAS Member: $140 ISBN: 978-162708-333-1 Product Code: 02222G BEST SELLER! Microelectronics Failure Analysis Desk Reference, Seventh Edition Edited by Tejinder Gandhi • 2019 • 705 pages ASM Digital Library: $75 / ASM Member: $59 / Free to EDFAS Members EISBN: 978-1-62708-247-1 Print: $250/ ASM or EDFAS Member: $190 ISBN: 978-1-62708-239-6 Product Code: 09111G DIGITAL ONLY! STEM-in-SEM: Introduction to Scanning Transmission Electron Microscopy for Microelectronics Failure Analysis By Jason D. Holm, Benjamin W. Caplins • 2020 • 33 pages ASM Digital Library: $9 / Free to EDFAS Members EISBN: 978-1-62708-292-1 Electronic Device Failure AnalysisTM Magazine Case Histories • Industry News • Training Opportunities • Useful URLs • Product News Master FA Techniques Frequency: 4 issues per year Print: $160 / Free to EDFAS Members ISSN: 1537-0755 • CODEN: EDFAAO Product Code: EDFA Characterization and Failure Analysis of Plastics 2003 • 482 pages ASM Digital Library: $75 / ASM Member: $59 EISBN: 978-1-62708-281-5 Print: $270 / ASM Member: $205 ISBN: 978-0-87170-789-5 Product Code: 06978G Composite Filament Winding Edited by S.T. Peters • 2011 • 174 pages Print: $185 / ASM Member: $140 ISBN: 978-1-61503-722-3 Product Code: 05286G Engineered Materials Handbook® Volume 2: Engineering Plastics 1988 • 883 pages Print: $230 / ASM Member: $175 ISBN: 978-0-87170-280-7 Product Code: 06248G Volume 3: Adhesives and Sealants 1990 • 893 pages Print: $230 / ASM Member: $175 ISBN: 978-0-87170-281-4 Product Code: 06012G Volume 4: Ceramics and Glasses 1991 • 1217 pages Print: $230 / ASM Member: $175 ISBN: 978-0-87170-282-1 Product Code: 06912G SET SALE! SAVE UP TO $164 Engineered Materials Handbook® 3-Volume Set Print: $505 / ASM Member: $380 Product Code: 06943G Optical Microscopy of Fiber-Reinforced Composites By Brian S. Hayes and Luther M. Gammon • 2010 • 284 pages Print: $195 / ASM Member: $145 ISBN: 978-1-61503-044-6 Product Code: 05303G Structural Composite Materials By F.C. Campbell • 2010 • 630 pages ASM Digital Library: $49/ ASM Member: $39 EISBN: 978-1-62708-314-0 Print: $185 / ASM Member: $140 ISBN: 978-1-61503-037-8 Product Code: 05287G PLASTICS, COMPOSITES, AND CERAMICS / MICROELECTRONICS STEM-in-SEM STEM-in-SEM INTRODUCTION TO SCANNING TRANSMISSION ELECTRON MICROSCOPY FOR MICROELECTRONICS FAILURE ANALYSIS INTRODUCTION TO SCANNING TRANSMISSION ELECTRON MICROSCOPY FOR MICROELECTRONICS FAILURE ANALYSIS Jason D. Holm & Benjamin W. Caplins HOLM CAPLINS An ASM Materials Solutions Publication ASM International®, 2019, No. 05600G Materials Park, Ohio 44073-0002 www.asminternational .org ORDER TODAY! ASM DIGITAL LIBRARY™: DL.ASMINTERNATIONAL.ORG PRINT: ASMINTERNATIONAL.ORG/TECHNICAL-BOOKS CALL: 800.336.5152 OR +1 440.338.5151 MULTIPLE USERS: FOR MORE INFORMATION ON HOW TO SUBSCRIBE TO THE ASM DIGITAL LIBRARY™, CONTACT THE ONLINE DATABASE MANAGER AT 440.338.5409 OR EMAIL ONLINEDBSALES ASMINTERNATIONAL.ORG. Characterization and Failure Analysis of Plastics covers the performance of plastics and how it is characterized during design, property testing, and failure analysis. Selected by Choice magazine for its excellence in scholarship and presentation, the significance of its contribution to the field, and value, as an important treatment of the subject. Microelectronics Failure Analysis Desk Reference, Seventh Edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference o ers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. STEM-in-SEM: Introduction to Scanning Transmission Electron Microscopy for Microelectronics Failure Analysis explains how SEMs equipped with transmission electron detectors, besides producing higher-resolution images, reveal additional details such as di raction patterns, grain texture, sample thickness, and subsurface defects. PLASTICS, COMPOSITES, AND CERAMICS MICROELECTRONICS FAILURE ANALYSIS
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