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ASM NEWS A D V A N C E D M A T E R I A L S & P R O C E S S E S | F E B R U A R Y / M A R C H 2 0 2 1 3 4 In This Issue Submit news of ASM and its members, chapters, and affiliate societies to Joanne Miller, editor, ASM News | ASM International 9639 Kinsman Road | Materials Park, OH 44073 | P 440.338.5455 | F 440.338.4634 | E joanne.miller@asminternational.org Contact ASM International at 9639 Kinsman Road, Materials Park, OH 44073 | P 440.338.5151 ext. 0 or 800.336.5152 (toll free in U.S. and Canada) | F 440.338.4634 | E MemberServiceCenter@asminternational.org | W asminternational.org ASM NEWS 34 Affiliate Societies Name Committee Chairs 36 Board of Trustee Nominations 40 Tribute to George Dieter 44 Women in Engineering 45 Chapters in the News AFFILIATE SOCIETIES NAME COMMITTEE CHAIRS FOR 2020-2021 TERM T he boards of the Electronic Device Failure Analysis Society (EDFAS), Failure Analysis Society (FAS), Heat Treating Society (HTS), International Metallographic Society (IMS), and Thermal Spray Society (TSS) have ap- pointed chairs to each of their committees for the 2020-2021 term. Chairs for ASM Society and General Committees and Councils appeared in the January 2021 issue of ASM News. The purpose of each committee is stated on its affiliate soci- ety website under the Membership and Networking tab. Electronic Device Failure Analysis Society (EDFAS) James Demarest, senior engineer, IBM, serves as pres- ident of EDFAS. Lee Knauss, FASM, director, engineering and science, Booz Allen Hamilton, serves as immediate past president of EDFAS and chair of the EDFAS Awards & Nominations Committee. Felix Beaudoin, FASM, PMTS product development engineer, GlobalFoundries, serves as vice president/finance officer of EDFAS. Bhanu Sood, Code 371 – Reliability and Risk Assess- ment Branch, NASA Goddard Space Flight Center, continues to serve as chair of the Education Subcommittee. Tom Moore, FASM, president, Waviks Inc., continues as chair of the EDFAS Membership Subcommittee. Nicholas Antoniou, vice president of product man- agement, PrimeNano Inc., continues to serve as chair of the Electronic Device Failure Analysis Editorial Board. Susan Li, senior manager, Cypress Semiconductor Corp., was named vice chair of the Events Committee. Failure Analysis Society (FAS) James Lane, director, materials science practice, Rim- kus Consulting Group Inc., serves as president of FAS. Pierre Dupont, key account manager − industry, Schaeffler Belgium Sprl/byba, serves as immediate past president of FAS and chair of the FAS Awards & Nominations Committee. Michael Connelly, FASM, consultant, Connelly Consulting, continues to serve as chair of the Education Subcommittee. Michael E. Stevenson, president, ESI, continues as chair of the Journal of Failure Analysis and Prevention Edi- torial Committee. Erik Mueller, materials research engineer, National Transportation Safety Board, was named chair of the Inter- national Relations Committee. Knauss Demarest Beaudoin Lane Dupont Moore Sood Antoniou Li Connelly Stevenson Mueller